List of AMD mobile processors
Features overview
[edit]CPUs
[edit]This section is empty. You can help by adding to it. (March 2023) |
APUs
[edit]Initial platform (2003)
[edit]Launched in 2003, the initial platform for mobile AMD processors consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors – Socket 754
|
Mobile chipset | D-sub and HyperTransport 1.0 |
Mobile Sempron
[edit]"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.95 – 1.4 V | 13 – 62 W | July 28, 2004 | SMN2600BIX2AY |
Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.95 – 1.4 V | 13 – 62 W | July 28, 2004 | SMN2800BIX3AY |
Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.95 – 1.4 V | 13 – 62 W | July 28, 2004 | SMN3000BIX2AY |
"Dublin" (Socket 754, CG, 130 nm, Low power)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.975 – 1.25 V | 9 – 25 W | July 28, 2004 | SMS2600BOX2LA |
Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.975 – 1.25 V | 9 – 25 W | July 28, 2004 | SMS2800BOX3LA |
"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.95 – 1.4 V | 62 W | July 2004 | SMN2600BIX2BA |
Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.95 – 1.4 V | 62 W | July 2004 | SMN2800BIX3BA |
Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.95 – 1.4 V | 62 W | July 2004 | SMN3000BIX2BA |
Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.95 – 1.4 V | 62 W | May 3, 2005 | SMN3100BIX3BA |
Mobile Sempron 3300+ | 2000 MHz | 128 kB | 800 MHz | 10x | 0.95 – 1.4 V | 62 W | August 19, 2005 | SMN3300BIX2BA |
"Sonora" (Socket 754, D0, 90 nm, Low power)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 2600+ | 1600 MHz | 128 kB | 800 MHz | 8x | 0.975 – 1.25 V | 25 W | July 2004 | SMS2600BOX2LB |
Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.975 – 1.25 V | 25 W | July 2004 | SMS2800BOX3LB |
Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.975 – 1.25 V | 25 W | November 23, 2004 | SMS3000BOX2LB |
Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.975 – 1.25 V | 25 W | January 2005 | SMS3100BOX3LB |
"Albany" (Socket 754, E6, 90 nm, Desktop replacement)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.95 – 1.4 V | 62 W | July 15, 2005 | SMN3000BIX2BX |
Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.95 – 1.4 V | 62 W | July 15, 2005 | SMN3100BIX3BX |
Mobile Sempron 3300+ | 2000 MHz | 128 kB | 800 MHz | 10x | 0.95 – 1.4 V | 62 W | July 15, 2005 | SMN3300BIX2BX |
Mobile Sempron 3400+ | 2000 MHz | 256 kB | 800 MHz | 10x | 0.95 – 1.4 V | 62 W | January 23, 2006 | SMN3400BIX3BX |
Mobile Sempron 3600+ | 2200 MHz | 128 kB | 800 MHz | 11x | 0.95 – 1.4 V | 62 W | May 17, 2006 | SMN3600BIX2BX |
"Roma" (Socket 754, E6, 90 nm, Low power)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 2800+ | 1600 MHz | 256 kB | 800 MHz | 8x | 0.95 – 1.2 V | 25 W | July 15, 2005 | SMS2800BQX3LF |
Mobile Sempron 3000+ | 1800 MHz | 128 kB | 800 MHz | 9x | 0.95 – 1.2 V | 25 W | July 15, 2005 | SMS3000BQX2LE SMS3000BQX2LF |
Mobile Sempron 3100+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.95 – 1.2 V | 25 W | July 15, 2005 | SMS3100BQX3LE |
Mobile Sempron 3300+ | 2000 MHz | 128 kB | 800 MHz | 10x | 0.95 – 1.2 V | 25 W | July 2005 | SMS3300BQX2LE |
Mobile Sempron 3400+ | 2000 MHz | 256 kB | 800 MHz | 10x | 0.95 – 1.2 V | 25 W | May 17, 2006 | SMS3400BQX3LE |
Mobile Athlon 64
[edit]"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8x | 1.50 V | 19 – 81.5 W | Socket 754 | May 2004 | AMA2700BEY4AP (C0) |
Mobile Athlon 64 2800+ | 1600 MHz | 1024 kB | 800 MHz | 8x | 1.50 V | 19 – 81.5 W | Socket 754 | February 2004 | AMA2800BEX5AP (C0) AMA2800BEX5AR (CG) |
Mobile Athlon 64 3000+ | 1800 MHz | 1024 kB | 800 MHz | 9x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3000BEX5AP (C0) AMA3000BEX5AR (CG) |
Mobile Athlon 64 3200+ | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3200BEX5AP (C0) AMA3200BEX5AR (CG) |
Mobile Athlon 64 3400+ | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3400BEX5AP (C0) AMA3400BEX5AR (CG) |
Mobile Athlon 64 3700+ | 2400 MHz | 1024 kB | 800 MHz | 12x | 1.50 V | 19 – 81.5 W | Socket 754 | September 2003 | AMA3700BEX5AP (C0) AMA3700BEX5AR (CG) |
"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 2800+ | 1600 MHz | 1024 kB | 800 MHz | 8x | 1.40 V | 62 W | Socket 754 | September 2003 | AMN2800BIX5AP (C0) AMN2800BIX5AR (CG) |
Mobile Athlon 64 3000+ | 1800 MHz | 1024 kB | 800 MHz | 9x | 1.40 V | 62 W | Socket 754 | September 2003 | AMN3000BIX5AP (C0) AMN3000BIX5AR (CG) |
Mobile Athlon 64 3200+ | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.40 V | 62 W | Socket 754 | September 2003 | AMN3200BIX5AP (C0) AMN3200BIX5AR (CG) |
Mobile Athlon 64 3400+ | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.40 V | 62 W | Socket 754 | February 2004 | AMN3400BIX5AR (CG) |
"ClawHammer" (CG, 130 nm, 35 W TDP)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8x | 1.20 V | 35 W | Socket 754 | May 2004 | AMD2700BQX4AR |
"Odessa" (CG, 130 nm, Desktop replacement)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 2800+ | 1800 MHz | 512 kB | 800 MHz | 8x | 1.50 V | 19 – 81.5 W | Socket 754 | April 2004 | AMA2800BEX4AX |
"Odessa" (CG, 130 nm, 35 W TDP)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8× | 1.20 V | 35 W | Socket 754 | May 2004 | AMD2700BQX4AX |
Mobile Athlon 64 2800+ | 1800 MHz | 512 kB | 800 MHz | 9× | 1.20 V | 35 W | Socket 754 | May 2004 | AMD2800BQX4AX |
Mobile Athlon 64 3000+ | 2000 MHz | 512 kB | 800 MHz | 10× | 1.20 V | 35 W | Socket 754 | May 2004 | AMD3000BQX4AX |
"Oakville" (D0, 90 nm, 35 W TDP Low Power)
[edit]MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 2700+ | 1600 MHz | 512 kB | 800 MHz | 8× | 1.35 V | 35 W | Socket 754 | August 17, 2004 | AMD2700BKX4LB |
Mobile Athlon 64 2800+ | 1800 MHz | 512 kB | 800 MHz | 9× | 1.35 V | 35 W | Socket 754 | August 17, 2004 | AMD2800BKX4LB |
Mobile Athlon 64 3000+ | 2000 MHz | 512 kB | 800 MHz | 10× | 1.35 V | 35 W | Socket 754 | August 17, 2004 | AMD3000BKX4LB |
"Newark" (E5, 90 nm, 62 W TDP)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Socket | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Mobile Athlon 64 3000+ | 1800 MHz | 1024 kB | 800 MHz | 9× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3000BKX5BU |
Mobile Athlon 64 3200+ | 2000 MHz | 1024 kB | 800 MHz | 10× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3200BKX5BU |
Mobile Athlon 64 3400+ | 2200 MHz | 1024 kB | 800 MHz | 11× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3400BKX5BU |
Mobile Athlon 64 3700+ | 2400 MHz | 1024 kB | 800 MHz | 12× | 1.35 V | 62 W | Socket 754 | April 14, 2005 | AMN3700BKX5BU |
Mobile Athlon 64 4000+ | 2600 MHz | 1024 kB | 800 MHz | 13× | 1.35 V | 62 W | Socket 754 | August 16, 2005 | AMN4000BKX5BU |
Turion 64
[edit]"Lancaster" (90 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion 64 ML-28 | 1600 MHz | 512 kB | 800 MHz | 8x | 1.35 V | 35 W | Socket 754 | June 22, 2005 | TMDML28BKX4LD |
Turion 64 ML-30 | 1600 MHz | 1024 kB | 800 MHz | 8x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML30BKX5LD |
Turion 64 ML-32 | 1800 MHz | 512 kB | 800 MHz | 9x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML32BKX4LD |
Turion 64 ML-34 | 1800 MHz | 1024 kB | 800 MHz | 9x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML34BKX5LD |
Turion 64 ML-37 | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.35 V | 35 W | Socket 754 | March 10, 2005 | TMDML37BKX5LD |
Turion 64 ML-40 | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.35 V | 35 W | Socket 754 | June 22, 2005 | TMDML40BKX5LD |
Turion 64 ML-42 | 2400 MHz | 512 kB | 800 MHz | 12x | 1.35 V | 35 W | Socket 754 | October 4, 2005 | TMDML42BKX4LD |
Turion 64 ML-44 | 2400 MHz | 1024 kB | 800 MHz | 12x | 1.35 V | 35 W | Socket 754 | January 4, 2006 | TMDML44BKX5LD |
Turion 64 MT-28 | 1600 MHz | 512 kB | 800 MHz | 8x | 1.20 V | 25 W | Socket 754 | June 22, 2005 | TMSMT28BQX4LD |
Turion 64 MT-30 | 1600 MHz | 1024 kB | 800 MHz | 8x | 1.20 V | 25 W | Socket 754 | March 10, 2005 | TMSMT30BQX5LD |
Turion 64 MT-32 | 1800 MHz | 512 kB | 800 MHz | 9x | 1.20 V | 25 W | Socket 754 | March 10, 2005 | TMSMT32BQX4LD |
Turion 64 MT-34 | 1800 MHz | 1024 kB | 800 MHz | 9x | 1.20 V | 25 W | Socket 754 | March 10, 2005 | TMSMT34BQX5LD |
Turion 64 MT-37 | 2000 MHz | 1024 kB | 800 MHz | 10x | 1.20 V | 25 W | Socket 754 | August 8, 2005 | TMSMT37BQX5LD |
Turion 64 MT-40 | 2200 MHz | 1024 kB | 800 MHz | 11x | 1.20 V | 25 W | Socket 754 | August 8, 2005 | TMSMT40BQX5LD |
Kite platform (2006)
[edit]Introduced in 2006, the Kite platform consists of:
AMD mobile | Kite platform |
---|---|
Mobile processor | Processors – Socket S1
|
Mobile chipset | |
Mobile support |
|
Mobile Sempron
[edit]"Keene" (Socket S1, F2, 90 nm, Low power)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Mobile Sempron 3200+ | 1600 MHz | 512 kB | 800 MHz | 8x | 0.950 – 1.125 V | 25 W | May 17, 2006 | SMS3200HAX4CM |
Mobile Sempron 3400+ | 1800 MHz | 256 kB | 800 MHz | 9x | 0.950 – 1.125 V | 25 W | May 17, 2006 | SMS3400HAX3CM |
Mobile Sempron 3500+ | 1800 MHz | 512 kB | 800 MHz | 9x | 0.950 – 1.125 V | 25 W | May 17, 2006 | SMS3500HAX4CM |
Mobile Sempron 3600+ | 2000 MHz | 256 kB | 800 MHz | 10x | 0.950 – 1.125 V | 25 W | Oct 23, 2006 | SMS3600HAX3CM |
Turion 64
[edit]"Richmond" (90 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion 64 MK-36 | 2000 MHz | 512 kB | 800 MHz | 10x | 1.15 V | 31 W | Socket S1 | September 1, 2006 | TMDMK36HAX4CM |
Turion 64 MK-38 | 2200 MHz | 512 kB | 800 MHz | 11x | 1.15 V | 31 W | Socket S1 | Q1 2007 | TMDMK38HAX4CM |
Turion 64 X2
[edit]"Taylor" (90 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion 64 X2 TL-50 | 1600 MHz | 2 × 256 kB | 800 MHz | 8x | 0.8 – 1.10 V | 31 W | Socket S1 | May 17, 2006 | TMDTL50HAX4CT |
"Trinidad" (90 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion 64 X2 TL-52 | 1600 MHz | 2 × 512 kB | 800 MHz | 8x | 0.8 – 1.125 V | 31 W | Socket S1 | May 17, 2006 | TMDTL52HAX5CT |
Turion 64 X2 TL-56 | 1800 MHz | 2 × 512 kB | 800 MHz | 9x | 0.8 – 1.125 V | 33 W | Socket S1 | May 17, 2006 | TMDTL56HAX5CT |
Turion 64 X2 TL-60 | 2000 MHz | 2 × 512 kB | 800 MHz | 10x | 0.8 – 1.125 V | 35 W | Socket S1 | May 17, 2006 | TMDTL60HAX5CT |
Turion 64 X2 TL-64 | 2200 MHz | 2 × 512 kB | 800 MHz | 11x | 0.8 – 1.125 V | 35 W | Socket S1 | January 30, 2007 | TMDTL64HAX5CT |
Kite Refresh platform (2007)
[edit]AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.
AMD mobile | Kite Refresh platform |
---|---|
Mobile processor | Processors – Socket S1
|
Mobile chipset | |
Mobile support |
|
Mobile Sempron
[edit]"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
Model Number | Frequency | L2 Cache | HyperTransport | Mult.2 | Voltage | TDP | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|
Sempron 2100+ fanless[1] | 1000 MHz | 256 kB | 800 MHz | 5x | 0.950 – 1.125 V | 9 W | May 30, 2007 | SMF2100HAX3DQE (G1) |
Mobile Sempron 3600+ | 2000 MHz | 256 kB | 800 MHz | 10x | 25 W | SMS3600HAX3DN (G2) | ||
Mobile Sempron 3700+ | 2000 MHz | 512 kB | 800 MHz | 10x | 25 W | SMS3700HAX4DQE (G1) | ||
Mobile Sempron 3800+ | 2200 MHz | 256 kB | 800 MHz | 11x | 31 W | SMD3800HAX3DN (G2) | ||
Mobile Sempron 4000+ | 2200 MHz | 512 kB | 800 MHz | 11x | 31 W | SMD4000HAX4DN (G2) |
Athlon 64 X2
[edit]"Tyler" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Athlon 64 X2 TK-42 | 1600 MHz | 2 × 512 kB | 800 MHz | 8.0x | 1.075/1.10/1.125 V | 20 W | Socket S1 | AMETK42HAX5DM | |
Athlon 64 X2 TK-53 | 1700 MHz | 2 × 256 kB | 800 MHz | 8.5x | 1.075/1.10/1.125 V | 31 W | Socket S1 | August 20, 2007 | AMDTK53HAX4DC |
Athlon 64 X2 TK-55 | 1800 MHz | 2 × 256 kB | 800 MHz | 9.0x | 1.075/1.10/1.125 V | 31 W | Socket S1 | Aug 20 2007 | AMDTK55HAX4DC |
Athlon 64 X2 TK-57 | 1900 MHz | 2 × 256 kB | 800 MHz | 9.5x | 1.075/1.10/1.125 V | 31 W | Socket S1 | 2008 | AMDTK57HAX4DM |
Turion 64 X2
[edit]"Tyler" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion 64 X2 TL-56 | 1800 MHz | 2 × 512 kB | 800 MHz | 9.0x | 1.075/1.10/1.125 V | 31 W | Socket S1 | May 7, 2007 | TMDTL56HAX5DC |
Turion 64 X2 TL-58 | 1900 MHz | 2 × 512 kB | 800 MHz | 9.5x | 1.075/1.10/1.125 V | 31 W | Socket S1 | May 7, 2007 | TMDTL58HAX5DC |
Turion 64 X2 TL-60 | 2000 MHz | 2 × 512 kB | 800 MHz | 10.0x | 1.075/1.10/1.125 V | 31 W | Socket S1 | May 7, 2007 | TMDTL60HAX5DC |
Turion 64 X2 TL-62 | 2100 MHz | 2 × 512 kB | 800 MHz | 10.5x | 1.075/1.10/1.125 V | 35 W | Socket S1 | Jan 21 2008 | TMDTL62HAX5DM |
Turion 64 X2 TL-64 | 2200 MHz | 2 × 512 kB | 800 MHz | 11.0x | 1.075/1.10/1.125 V | 35 W | Socket S1 | May 7, 2007 | TMDTL64HAX5DC |
Turion 64 X2 TL-66 | 2300 MHz | 2 × 512 kB | 800 MHz | 11.5x | 1.075/1.10/1.125 V | 35 W | Socket S1 | May 7, 2007 Jul 10 2007 |
TMDTL66HAX5DC TMDTL66HAX5DM |
Turion 64 X2 TL-68 | 2400 MHz | 2 × 512 kB | 800 MHz | 12.0x | 1.075/1.10/1.125 V | 35 W | Socket S1 | December 19, 2007 | TMDTL68HAX5DM |
Puma platform (2008)
[edit]The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset | AMD M780 series chipset
|
Mobile support |
|
Mobile Sempron
[edit]"Sable" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Sempron SI-40 | 2000 MHz | 512 kB | 1800 MHz | 10.0x | 1.075 – 1.125 V | 25 W | Socket S1G2 | June 4, 2008 | SMSI40SAM12GG |
Sempron SI-42 | 2100 MHz | 512 kB | 1800 MHz | 10.5x | 1.075 – 1.125 V | 25 W | Socket S1G2 | Q3 2008 | SMSI42SAM12GG |
Athlon X2
[edit]"Lion" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Athlon X2 QL-60 | 1900 MHz | 2 × 512 kB | 1800 MHz | 9.5x | 0.95 – 1.1 V | 35 W | Socket S1G2 | June 4, 2008 | AMQL60DAM22GG |
Athlon X2 QL-62 | 2000 MHz | 2 × 512 kB | 1800 MHz | 10.0x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q3 2008 | AMQL62DAM22GG |
Athlon X2 QL-64 | 2100 MHz | 2 × 512 kB | 1800 MHz | 10.5x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL64DAM22GG |
Athlon X2 QL-65 | 2100 MHz | 2 × 512 kB | 2000 MHz | 10.5x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL65DAM22GG |
Athlon X2 QL-66 | 2200 MHz | 2 × 512 kB | 1800 MHz | 11.0x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL66DAM22GG |
Athlon X2 QL-67 | 2200 MHz | 2 × 512 kB | 2000 MHz | 11.0x | 0.95 – 1.1 V | 35 W | Socket S1G2 | Q4 2008 | AMQL67DAM22GG |
Turion X2
[edit]"Lion" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion X2 RM-70[2] | 2000 MHz | 2 × 512 kB | 1800 MHz | 10x | 0.75 – 1.2 V | 31 W | Socket S1G2 | June 4, 2008 | TMRM70DAM22GG |
Turion X2 RM-72[2] | 2100 MHz | 2 × 512 kB | 1800 MHz | 10.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMRM72DAM22GG |
Turion X2 RM-74[2] | 2200 MHz | 2 × 512 kB | 1800 MHz | 11.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM74DAM22GG |
Turion X2 RM-75[2] | 2200 MHz | 2 × 512 kB | 2000 MHz | 11.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM75DAM22GG |
Turion X2 RM-76[2] | 2300 MHz | 2 × 512 kB | 1800 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM76DAM22GG |
Turion X2 RM-77[2] | 2300 MHz | 2 × 512 kB | 2000 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q4 2008 | TMRM77DAM22GG |
Turion X2 Ultra
[edit]"Lion" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion X2 Ultra ZM-80[2] | 2100 MHz | 2 × 1 MB | 1800 MHz | 10.5x | 0.75 – 1.2 V | 32 W | Socket S1G2 | June 4, 2008 | TMZM80DAM23GG |
Turion X2 Ultra ZM-82[2] | 2200 MHz | 2 × 1 MB | 1800 MHz | 11.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | June 4, 2008 | TMZM82DAM23GG |
Turion X2 Ultra ZM-84[2] | 2300 MHz | 2 × 1 MB | 1800 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM84DAM23GG |
Turion X2 Ultra ZM-85[2] | 2300 MHz | 2 × 1 MB | 2200 MHz | 11.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM85DAM23GG |
Turion X2 Ultra ZM-86[2] | 2400 MHz | 2 × 1 MB | 1800 MHz | 12.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | June 4, 2008 | TMZM86DAM23GG |
Turion X2 Ultra ZM-87[2] | 2400 MHz | 2 × 1 MB | 2200 MHz | 12.0x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM87DAM23GG |
Turion X2 Ultra ZM-88[2] | 2500 MHz | 2 × 1 MB | 1800 MHz | 12.5x | 0.75 – 1.2 V | 35 W | Socket S1G2 | Q3 2008 | TMZM88DAM23GG |
Yukon platform (2009)
[edit]The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset | AMD RS690E series chipset + SB600 southbridge
|
Mobile support |
|
Sempron
[edit]"Huron" (65 nm, Low power)
[edit]- Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
- Sempron 210U supports extra AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Package/Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Sempron 200U[3] | 1000 MHz | 256 kB | 1600 MHz | 5x | 0.925 V | 8 W | Socket ASB1 | January 8, 2009 | SMF200UOAX3DV |
Sempron 210U | 1500 MHz | 256 kB | 1600 MHz | 7.5x | 0.925 V | 15 W | Socket ASB1 | January 8, 2009 | SMG210UOAX3DX |
Athlon Neo
[edit]"Huron" (65 nm, 15 W TDP)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Package | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Athlon Neo MV-40 | 1600 MHz | 512 kB | 800 MHz | 8x | 1.1 V | 15 W | Socket ASB1 | January 8, 2009 | AMGMV40OAX4DX |
"Sherman" (65 nm, 15 W TDP)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Package | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Athlon Neo TF-20 | 1600 MHz | 512 kB | 800 MHz | 8x | 1.0 V | 15 W | Socket S1 | January 8, 2009 | AMGTF20HAX4DN |
"Congo" (65 nm, 13 W TDP)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Package | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Athlon Mobile X2 L310 | 1200 MHz | 2 × 512 kB | 800 MHz | 6x | 0.925 V | 13 W | Socket S1 | January 8, 2009 | AMML310HAX5DM |
Turion
[edit]"Congo" (65 nm, 20 W TDP)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | VCore | TDP | Package | Release Date | Part Number(s) |
---|---|---|---|---|---|---|---|---|---|
Turion Mobile X2 L510 | 1600 MHz | 2 × 512 kB | 800 MHz | 8x | 0.925 V | 20 W | Socket S1 | January 8, 2009 | TMEL510HAX5DM |
Congo platform (2009)
[edit]The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset | AMD M780G(RS780M) series chipset + SB710 southbridge
|
Athlon Neo X2
[edit]"Conesus" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Athlon Neo X2 L325 | 1500 MHz | 2 × 512 kB | 800 MHz | 7.5x | 0.925 V | 18 W | Socket ASB1 | August 10, 2009 | AMZL325OAX5DY |
Athlon Neo X2 L335 | 1600 MHz | 2 × 512 kB | 800 MHz | 8.0x | 0.925 V | 18 W | Socket ASB1 | February 2010 | AMZL335OAX5DY |
Turion Neo X2
[edit]"Conesus" (65 nm)
[edit]MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!
Model Number | Frequency | L2 Cache | HT | Mult.1 | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Turion Neo X2 L625 | 1600 MHz | 2 × 512 kB | 800 MHz | 8x | 0.925 V | 18 W | Socket ASB1 | August 10, 2009 | TMZL625OAX5DY |
Tigris platform (2009)
[edit]The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset | AMD M785(RS880M) series chipset + SB710 southbridge
|
Sempron
[edit]"Caspian" (45 nm)
[edit]Single-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model Number | Frequency | L2 Cache | FPU width[6] | HT | Mult. | Voltage | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|---|
Sempron M100 | 2000 MHz | 512 kB | 64-bit | 1600 MHz | 10.0x | 25 W | Socket S1G3 | September 10, 2009 | SMM100SBO12GQ | |
Sempron M120 | 2100 MHz | 512 kB | 64-bit | 1600 MHz | 10.5x | 25 W | Socket S1G3 | September 10, 2009 | SMM120SBO12GQ | |
Sempron M140 | 2200 MHz | 512 kB | 64-bit | 1600 MHz | 10.5x | 25 W | Socket S1G3 | April 2010 | SMM140SBO12GQ |
Athlon II
[edit]"Caspian" (45 nm)
[edit]Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model number | Frequency | L2 cache | FPU width[6] | HT | Mult. | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Athlon II M300 | 2.0 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 10× | 35 W | Socket S1G3 | September 10, 2009 | AMM300DBO22GQ |
Athlon II M320 | 2.1 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 10.5× | 35 W | Socket S1G3 | September 10, 2009 | AMM320DBO22GQ |
Athlon II M340 | 2.2 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 11× | 35 W | Socket S1G3 | September 10, 2009 | AMM340DBO22GQ |
Athlon II M360 | 2.3 GHz | 2 × 512 kB | 64-bit | 1.6 GHz | 11× | 35 W | Socket S1G3 | May 2010 | AMM360DBO22GQ |
Turion II
[edit]"Caspian" (45 nm)
[edit]Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model number | Clock speed |
L2 cache | FPU width[6] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Turion II M500 | 2.2 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 11× | 35 W | Socket S1G3 | September 10, 2009 | TMM500DBO22GQ |
Turion II M520 | 2.3 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 11.5× | 35 W | Socket S1G3 | September 10, 2009 | TMM520DBO22GQ |
Turion II M540 | 2.4 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 12× | 35 W | Socket S1G3 | September 10, 2009 | TMM540DBO22GQ |
Turion II M560 | 2.5 GHz | 2 × 512 KB | 128-bit | 1.8 GHz | 12× | 35 W | Socket S1G3 | April 2010 | TMM560DBO22GQ |
Turion II (Ultra)
[edit]"Caspian" (45 nm)
[edit]Dual-core mobile processor
MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
Model number | Clock speed |
L2 cache | FPU width[6] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Turion II Ultra M600 | 2.4 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12× | 35 W | Socket S1G3 | September 10, 2009 | TMM600DBO23GQ |
Turion II Ultra M620 | 2.5 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12.5× | 35 W | Socket S1G3 | September 10, 2009 | TMM620DBO23GQ |
Turion II Ultra M640 | 2.6 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13× | 35 W | Socket S1G3 | September 10, 2009 | TMM640DBO23GQ |
Turion II Ultra M660 | 2.7 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13.5× | 35 W | Socket S1G3 | September 10, 2009 | TMM660DBO23GQ |
Nile platform (2010)
[edit]The Nile platform [7][8] introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors |
Mobile chipset | AMD RS880 series chipset + SB850 southbridge
|
- MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
- Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)
V series
[edit]"Geneva" (45 nm)
[edit]Single-core mobile processor
Model number |
Clock speed |
L2 cache | FPU width[8] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
V105 | 1.2 GHz | 512 KB | 64-bit | 1.0 GHz | 6× | 9 W | ASB2 | May 12, 2010 | VMV105FDV12GM |
Athlon II Neo
[edit]"Geneva" (45 nm)
[edit]Single-core mobile processor Single-core mobile processor
Model number | Frequency | L2 Cache | FPU width[10] | HT | Mult. | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Athlon II Neo K125 | 1.7 GHz | 1 MB | 64-bit | 1.0 GHz | 8.5× | 12 W | ASB2 | May 12, 2010 | AMK125LAV13GM |
Athlon II Neo K145 | 1.8 GHz | 1 MB | 64-bit | 1.0 GHz | 9× | 12 W | ASB2 | January 4, 2011 | AMK145LAV13GM |
Dual-core mobile processor
Model number | Frequency | L2 Cache | FPU width[10] | HT | Mult. | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Athlon II Neo N36L | 1.3 GHz | 2 × 1 MB | 64-bit | 1.0 GHz | 6.5× | 12 W | ASB2 | April 26, 2010 | AEN36LLAV23GME |
Athlon II Neo K325 | 1.3 GHz | 2 × 1 MB | 64-bit | 1.0 GHz | 6.5× | 12 W | ASB2 | May 12, 2010 | AMK325LAV23GM |
Athlon II Neo K345 | 1.4 GHz | 2 × 1 MB | 64-bit | 1.0 GHz | 7× | 12 W | ASB2 | January 4, 2011 | AMK345LAV23GM |
Turion II Neo
[edit]"Geneva" (45 nm)
[edit]Dual-core mobile processor
Model number | Clock speed |
L2 cache | FPU width[10] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Turion II Neo N40L | 1.5 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 7.5× | 15 W | Socket ASB2 | April 26, 2010 | TEN40LGAV23GME |
Turion II K625 | 1.5 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 7.5× | 15 W | Socket ASB2 | May 12, 2010 | TMK625GAV23GM |
Turion II K645 | 1.6 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 8× | 15 W | Socket ASB2 | January 4, 2011 | TMK645GAV23GM |
Turion II K665 | 1.7 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 8.5× | 15 W | Socket ASB2 | May 12, 2010 | TMK665GAV23GM |
Turion II K685 | 1.8 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 9× | 15 W | Socket ASB2 | January 4, 2011 | TMK685GAV23GM |
Turion II Neo N54L | 2.2 GHz | 2 × 1 MB | 128-bit | 1.6 GHz | 11× | 25 W | Socket ASB2 | May 2010 | TEN54LSDV23GME |
Danube platform (2010)
[edit]The Danube platform[7][10] introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors |
Mobile chipset | AMD RS880 series chipset + SB850 southbridge
|
- MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
- Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)
V series
[edit]Champlain (45 nm)
[edit]Single-core mobile processor
Model number |
Clock speed |
L2 cache | FPU width[10] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
V120 | 2.2 GHz | 512 KB | 64-bit | 1.6 GHz | 11× | 25 W | S1G4 | May 12, 2010 | VMV120SGR12GM |
V140 | 2.3 GHz | 512 KB | 64-bit | 1.6 GHz | 11.5× | 25 W | S1G4 | October 4, 2010 | VMV140SGR12GM |
V160 | 2.4 GHz | 512 KB | 64-bit | 1.6 GHz | 12× | 25 W | S1G4 | January 4, 2011 | VMV160SGR12GM |
Athlon II
[edit]Champlain (45 nm)
[edit]Dual-core mobile processor
Model Number | Frequency | L2 cache | FPU width[10] | HT | Mult. | TDP | Socket | Release date | Order Part Number |
---|---|---|---|---|---|---|---|---|---|
Athlon II P320 | 2.1 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 10.5× | 25 W | Socket S1G4 | May 12, 2010 | AMP320SGR22GM |
Athlon II P340 | 2.2 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 11× | 25 W | Socket S1G4 | October 4, 2010 | AMP340SGR22GM |
Athlon II P360 | 2.3 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 11.5× | 25 W | Socket S1G4 | January 4, 2011 | AMP360SGR22GM |
Athlon II N330 | 2.3 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 11.5× | 35 W | Socket S1G4 | May 12, 2010 | AMN330DCR22GM |
Athlon II N350 | 2.4 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 12× | 35 W | Socket S1G4 | October 4, 2010 | AMN350DCR22GM |
Athlon II N370 | 2.5 GHz | 2 × 512 KB | 64-bit | 1.6 GHz | 12.5× | 35 W | Socket S1G4 | January 4, 2011 | AMN370DCR22GM |
Turion II
[edit]Champlain (45 nm)
[edit]Dual-core mobile processor
Model number | Clock speed |
L2 cache | FPU width[10] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Turion II P520 | 2.3 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 11.5× | 25 W | Socket S1G4 | May 12, 2010 | TMP520SGR23GM |
Turion II P540 | 2.4 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12× | 25 W | Socket S1G4 | October 4, 2010 | TMP540SGR23GM |
Turion II P560 | 2.5 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12.5× | 25 W | Socket S1G4 | October 19, 2010 | TMP560SGR23GM |
Turion II N530 | 2.5 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 12.5× | 35 W | Socket S1G4 | May 12, 2010 | TMN530DCR23GM |
Turion II N550 | 2.6 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13× | 35 W | Socket S1G4 | October 4, 2010 | TMN550DCR23GM |
Turion II N570 | 2.7 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13.5× | 35 W | Socket S1G4 | January 4, 2011 | TMN570DCR23GM |
Phenom II
[edit]- MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
- Unlike desktop models, mobile Phenom II-based models do not have L3 cache
- Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)
Champlain (45 nm)
[edit]Dual-core mobile processor
Model number | Clock speed |
L2 cache | FPU width[10] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Phenom II P650 | 2.6 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 13× | 25 W | Socket S1G4 | October 19, 2010 | HMP650SGR23GM |
Phenom II N620 | 2.8 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 14× | 35 W | Socket S1G4 | May 12, 2010 | HMN620DCR23GM |
Phenom II N640 | 2.9 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 14.5× | 35 W | Socket S1G4 | October 4, 2010 | HMN640DCR23GM |
Phenom II N660 | 3.0 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 15× | 35 W | Socket S1G4 | January 4, 2011 | HMN660DCR23GM |
Phenom II X620 BE | 3.1 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 15.5× | 45 W | Socket S1G4 | May 12, 2010 | HMX620HIR23GM |
Phenom II X640 BE | 3.2 GHz | 2 × 1 MB | 128-bit | 1.8 GHz | 16× | 45 W | Socket S1G4 | May 10, 2011 | HMX640HIR23GM |
Triple-core mobile processors
Model number | Clock speed |
L2 cache | FPU width[10] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Phenom II P820 | 1.8 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 9× | 25 W | Socket S1G4 | May 12, 2010 | HMP820SGR32GM |
Phenom II P840 | 1.9 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 9.5× | 25 W | Socket S1G4 | October 4, 2010 | HMP840SGR32GM |
Phenom II P860 | 2.0 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 10× | 25 W | Socket S1G4 | October 4, 2010 | HMP860SGR32GM |
Phenom II N830 | 2.1 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 10.5× | 35 W | Socket S1G4 | May 12, 2010 | HMN830DCR32GM |
Phenom II N850 | 2.2 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 11× | 35 W | Socket S1G4 | October 4, 2010 | HMN850DCR32GM |
Phenom II N870 | 2.3 GHz | 3 × 512 KB | 128-bit | 1.8 GHz | 11.5× | 35 W | Socket S1G4 | January 4, 2011 | HMN870DCR32GM |
Quad-core mobile processors
Model number | Clock speed |
L2 cache | FPU width[10] | Hyper Transport |
Multi | TDP | Socket | Release date | Part number |
---|---|---|---|---|---|---|---|---|---|
Phenom II P920 | 1.6 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 8× | 25 W | Socket S1G4 | May 12, 2010 | HMP920SGR42GM |
Phenom II P940 | 1.7 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 8.5× | 25 W | Socket S1G4 | October 4, 2010 | HMP940SGR42GM |
Phenom II P960 | 1.8 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 9× | 25 W | Socket S1G4 | October 19, 2010 | HMP960SGR42GM |
Phenom II N930 | 2.0 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 10× | 35 W | Socket S1G4 | May 12, 2010 | HMN930DCR42GM |
Phenom II N950 | 2.1 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 10.5× | 35 W | Socket S1G4 | October 4, 2010 | HMN950DCR42GM |
Phenom II N970 | 2.2 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 11× | 35 W | Socket S1G4 | January 4, 2011 | HMN970DCR42GM |
Phenom II X920 BE | 2.3 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 11.5× | 45 W | Socket S1G4 | May 12, 2010 | HMX920HIR42GM |
Phenom II X940 BE | 2.4 GHz | 4 × 512 KB | 128-bit | 1.8 GHz | 12× | 45 W | Socket S1G4 | January 4, 2011 | HMX940HIR42GM |
Brazos platform (2011)
[edit]AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset |
"Ontario" (40 nm)
[edit]- SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
- Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
- 2.5 GT/s UMI.
- Config GPU are Unified shaders : Texture mapping units : Render output units
- Socket FT1 (BGA-413)
Model Number | Step. | CPU | GPU | Memory Support |
TDP | Released | Part Number | Info | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult. | Voltage | Model | Config | Freq. | |||||||
C-30 | B0 | 1 | 1.2 GHz | — | 512 kB | 12× | 1.25 – 1.35 | HD 6250 | 80:8:4 | 276 MHz | DDR3-1066 | 9 W | January 4, 2011 | CMC30AFPB12GT | C-30 |
C-50 | 2 | 1.0 GHz | 2 × 512 kB | 10× | 1.05 – 1.35 | 277 MHz | CMC50AFPB22GT | C-50 | |||||||
C-60 | C0 | 1.33 GHz | HD 6290 | 276 – 400 MHz | August 22, 2011 | CMC60AFPB22GV | C-60 |
"Zacate" (40 nm)
[edit]- SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
- Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
- 2.5 GT/s UMI.
- Config GPU are Unified shaders : Texture mapping units : Render output units
- Socket FT1 (BGA-413)
Model Number | Step. | CPU | GPU | Memory Support |
TDP | Released | Part Number | Info | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult. | Voltage | Model | Config | Freq. | |||||||
E-240 | B0 | 1 | 1.5 GHz | — | 512 kB | 15× | 1.175 – 1.35 | HD 6310 | 80:8:4 | 500 MHz | DDR3-1066 | 18 W | January 4, 2011 | EME240GBB12GT | E-240 |
E-300 | B0 | 2 | 1.3 GHz | 2 × 512 kB | 13× | 488 MHz | August 22, 2011 | EME300GBB22GV | E-300 | ||||||
E-350 | B0 | 1.6 GHz | 16× | 1.25 – 1.35 | 492 MHz | January 4, 2011 | EME350GBB22GT | E-350 | |||||||
E-450 | B0 | 1.65 GHz | 16.5× | HD 6320 | 508 – 600 MHz | DDR3-1333 | August 22, 2011 | EME450GBB22GV | E-450 |
Sabine (Fusion) platform (2011)
[edit]The Sabine platform[15] introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset |
"Llano" (32 nm)
[edit]- SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
- Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
- 2.5 GT/s UMI.
- Transistors: 1.148 billion
- Die size: 228 mm²
Model Number | Step. | CPU | GPU | Memory Support |
TDP | Socket | Release Date | Part Number(s) | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult. | Vcore | Model | Config1 | Freq. | |||||||
E2-3000M | B0 | 2 | 1.8 GHz | 2.4 GHz | 2 × 512 kB | 18x | 0.9125 – 1.4125 | HD 6380G | 160:8:4 | 400 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | EM3000DDX22GX |
A4-3300M | B0 | 2 | 1.9 GHz | 2.5 GHz | 2 × 1 MB | 19x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3300DDX23GX |
A4-3305M | B0 | 2 | 1.9 GHz | 2.5 GHz | 2 × 512 kB | 19x | 0.8750 – 1.4125 | HD 6480G | 160:8:4 | 593 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3305DDX22GX |
A4-3310MX | B0 | 2 | 2.1 GHz | 2.5 GHz | 2 × 1 MB | 21x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3310HLX23GX |
A4-3320M | B0 | 2 | 2.0 GHz | 2.6 GHz | 2 × 1 MB | 20x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3320DDX23GX |
A4-3330MX | B0 | 2 | 2.2 GHz | 2.6 GHz | 2 × 1 MB | 22x | 0.9125 – 1.4125 | HD 6480G | 240:12:4 | 444 MHz | DDR3-1600 | 45 W | FS1 | December 7, 2011 | AM3330HLX23GX |
A6-3400M | B0 | 4 | 1.4 GHz | 2.3 GHz | 4 × 1 MB | 14x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3400DDX43GX |
A6-3410MX | B0 | 4 | 1.6 GHz | 2.3 GHz | 4 × 1 MB | 16x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1600 | 45 W | FS1 | June 14, 2011 | AM3410HLX43GX |
A6-3420M | B0 | 4 | 1.5 GHz | 2.4 GHz | 4 × 1 MB | 15x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3420DDX43GX |
A6-3430MX | B0 | 4 | 1.7 GHz | 2.4 GHz | 4 × 1 MB | 17x | 0.9125 – 1.4125 | HD 6520G | 320:16:8 | 400 MHz | DDR3-1600 | 45 W | FS1 | December 7, 2011 | AM3430HLX43GX |
A8-3500M | B0 | 4 | 1.5 GHz | 2.4 GHz | 4 × 1 MB | 15x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1333 | 35 W | FS1 | June 14, 2011 | AM3500DDX43GX |
A8-3510MX | B0 | 4 | 1.8 GHz | 2.5 GHz | 4 × 1 MB | 18x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1600 | 45 W | FS1 | June 14, 2011 | AM3510HLX43GX |
A8-3520M | B0 | 4 | 1.6 GHz | 2.5 GHz | 4 × 1 MB | 16x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1333 | 35 W | FS1 | December 7, 2011 | AM3520DDX43GX |
A8-3530MX | B0 | 4 | 1.9 GHz | 2.6 GHz | 4 × 1 MB | 19x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1600 | 45 W | FS1 | June 14, 2011 | AM3530HLX43GX |
A8-3550MX | B0 | 4 | 2.0 GHz | 2.7 GHz | 4 × 1 MB | 20x | 0.9125 – 1.4125 | HD 6620G | 400:20:8 | 444 MHz | DDR3-1600 | 45 W | FS1 | December 7, 2011 | AM3550HLX43GX |
1 Unified shaders : Texture mapping units : Render output units
Brazos 2.0 platform (2012)
[edit]AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors |
Mobile chipset |
"Ontario", "Zacate" (40 nm)
[edit]- SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
- Single-channel DDR3 SDRAM, DDR3L SDRAM
- 2.5 GT/s UMI.
- Config GPU are Unified shaders : Texture mapping units : Render output units
- Socket FT1 (BGA-413)
Model Number | Step. | CPU | GPU | Memory Support |
TDP | Release Date | Part Number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult. | Vcore | Model | Config | Freq. | Turbo | ||||||
C-70 | C0 | 2 | 1.0 GHz | 1.33 GHz | 2 × 512 kB | 10× | HD 7290 | 80:8:4 | 276 MHz | 400 MHz | DDR3-1066 | 9 W | September 27, 2012 | CMC70AFPB22GV | |
E1-1200 | B0 | 1.4 GHz | — | 14× | HD 7310 | 500 MHz | — | 18 W | June 6, 2012 | EM1200GBB22GV | |||||
E2-1500 | 1.48 GHz | 529 MHz | — | January 7, 2013 | |||||||||||
E2-1800 | 1.7 GHz | 17× | HD 7340 | 523 MHz | 680 MHz | DDR3-1333 | June 6, 2012 | EM1800GBB22GV | |||||||
E2-2000 | 1.75 GHz | 538 MHz | 700 MHz | January 7, 2013 |
Comal (Fusion) platform (2012)
[edit]The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:
AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
Mobile chipset |
"Trinity" (2012, 32 nm)
[edit]- MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
- Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
- 2.5 GT/s UMI.
- Transistors: 1.303 billion
- Die size: 246 mm²
Model Number | Step. | CPU | GPU | Memory Support |
TDP | Socket | Release Date | Part Number(s) | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult. | Vcore | Model | Config1 | Freq. | Turbo | |||||||
standard power | ||||||||||||||||
A4-4300M | B0 | 2 | 2.5 GHz | 3.0 GHz | 1 MB | 25× | 0.8125 – 1.3 | HD 7420G | 128:8:4 | 480 MHz | 655 MHz | DDR3-1600 | 35 W | FS1r2 | May 2012 | AM4300DEC23HJ |
A6-4400M | B0 | 2 | 2.7 GHz | 3.2 GHz | 1 MB | 27× | 0.8125 – 1.3 | HD 7520G | 192:12:4 | 496 MHz | 685 MHz | DDR3-1600 | 35 W | FS1r2 | May 15, 2012 | AM4400DEC23HJ |
A8-4500M | B0 | 4 | 1.9 GHz | 2.8 GHz | 2 × 2 MB | 19× | 0.8125 – 1.3 | HD 7640G | 256:16:8 | 496 MHz | 685 MHz | DDR3-1600 | 35 W | FS1r2 | May 15, 2012 | AM4500DEC44HJ |
A10-4600M | B0 | 4 | 2.3 GHz | 3.2 GHz | 2 × 2 MB | 23× | 0.8125 – 1.3 | HD 7660G | 384:24:8 | 496 MHz | 685 MHz | DDR3-1600 | 35 W | FS1r2 | May 15, 2012 | AM4600DEC44HJ |
low power | ||||||||||||||||
A4-4355M | B0 | 2 | 1.9 GHz | 2.4 GHz | 1 MB | 21× | HD 7400G | 192:12:4 | 327 MHz | 424 MHz | DDR3-1333 | 17 W | FP2 | September 27, 2012 | AM4355SHE23HJ | |
A6-4455M | B0 | 2 | 2.1 GHz | 2.6 GHz | 2 MB | 21× | 0.775 – 1.15 | HD 7500G | 256:16:8 | 327 MHz | 424 MHz | DDR3-1333 | 17 W | FP2 | May 15, 2012 | AM4455SHE24HJ |
A8-4555M | B0 | 4 | 1.6 GHz | 2.4 GHz | 2 × 2 MB | 16× | HD 7600G | 384:24:8 | 320 MHz | 424 MHz | DDR3-1333 | 19 W | FP2 | September 27, 2012 | AM4555SHE44HJ | |
A10-4655M | B0 | 4 | 2.0 GHz | 2.8 GHz | 2 × 2 MB | 20× | 0.85 – 1.2 | HD 7620G | 384:24:8 | 360 MHz | 496 MHz | DDR3-1333 | 25 W | FP2 | May 15, 2012 | AM4655SIE44HJ |
1 Config GPU are Unified shaders : Texture mapping units : Render output units
"Richland" (2013, 32 nm)
[edit]- Elite Performance APU.[16][17]
- MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
- Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
- 2.5 GT/s UMI.
- Transistors: 1.303 billion
- Die size: 246 mm²
Model Number | Step. | CPU | GPU | Memory Support |
TDP | Socket | Release Date | Part Number(s) | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult. | Vcore | Model | Config | Freq. | Turbo | |||||||
standard power | ||||||||||||||||
A4-5150M | 2 | 2.7 GHz | 3.3 GHz | 1 MB | HD 8350G | 128:8:4 | 533 MHz | 720 MHz | DDR3-1600 | 35 W | FS1r2 | Q1 2013 | AM5150DEC23HL | |||
A6-5350M | 2.9 GHz | 3.5 GHz | HD 8450G | 192:12:4 | 533 MHz | 720 MHz | DDR3-1600 | FS1r2 | Q1 2013 | AM5350DEC23HL | ||||||
A6-5357M | 2.9 GHz | 3.5 GHz | HD 8450G | 192 | 533 MHz | 720 MHz | DDR3L-1600 | FP2 (BGA) | May 2013 | AM5357DFE23HL | ||||||
A8-5550M | 4 | 2.1 GHz | 3.1 GHz | 2 × 2 MB | HD 8550G | 256:16:8 | 515 MHz | 720 MHz | DDR3-1600 | FS1r2 | Q1 2013 | AM5550DEC44HL | ||||
A8-5557M | 2.1 GHz | 3.1 GHz | HD 8550G | 256 | 554 MHz | 720 MHz | DDR3L-1600 | FP2 (BGA) | May 2013 | AM5557DFE44HL | ||||||
A10-5750M | 2.5 GHz | 3.5 GHz | HD 8650G | 384:24:8 | 533 MHz | 720 MHz | DDR3-1866 | FS1r2 | Q1 2013 | AM5750DEC44HL | ||||||
A10-5757M | 2.5 GHz | 3.5 GHz | HD 8650G | 384 | 600 MHz | 720 MHz | DDR3L-1600 | FP2 (BGA) | May 2013 | AM5757DFE44HL | ||||||
low power | ||||||||||||||||
A4-5145M | 2 | 2.0 GHz | 2.6 GHz | 1 MB | HD 8310G | 128 | 424 MHz | 554 MHz | DDR3L-1333 | 17 W | FP2 (BGA) | May 2013 | AM5145SIE44HL? | |||
A6-5345M | 2.2 GHz | 2.8 GHz | HD 8410G | 192 | 450 MHz | 600 MHz | DDR3L-1333 | May 2013 | AM5345SIE44HL? | |||||||
A8-5545M | 4 | 1.7 GHz | 2.7 GHz | 2 × 2 MB | HD 8510G | 384 | 450 MHz | 554 MHz | DDR3L-1333 | 19 W | May 2013 | AM5545SIE44HL | ||||
A10-5745M | 2.1 GHz | 2.9 GHz | HD 8610G | 384 | 533 MHz | 626 MHz | DDR3L-1333 | 25 W | May 2013 | AM5745SIE44HL |
1 Config GPU are Unified shaders : Texture mapping units : Render output units
Jaguar (2013)
[edit]AMD mobile | Initial platform |
---|---|
Mobile processor | Processors
|
"Temash" (2013, 28 nm)
[edit]Elite Mobility APU:
Model | Step. | CPU | GPU | Memory | TDP | Released | Part Number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult.1 | Vcore | Model | Config1 | Freq. | Turbo | ||||||
A4-1200 | B0[citation needed] | 2 | 1.0 GHz | — | 1 MB | HD 8180 | 128:8:4 | 225 MHz | — | DDR3L-1066 | 3.9 W | May 2013 | AT1200IFJ23HM | ||
A4-1250 | HD 8210 | 300 MHz | DDR3L-1333 | 8 W | May 2013 | AT1250IDJ23HM | |||||||||
A6-1450 | 4 | 1.4 GHz | 2 MB | HD 8250 | 300 MHz | 400 MHz | DDR3L-1066 | 8 W | May 2013 | AT1450IDJ44HM |
1 Unified shaders : Texture mapping units : Render output units
"Kabini" (2013, 28 nm)
[edit]Mainstream APU:
Model | Step. | CPU | GPU | Memory | TDP | Released | Part Number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Freq. | Turbo | L2 Cache | Mult.1 | Vcore | Model | Config1 | Freq. | Turbo | ||||||
E1-2100 | B0 | 2 | 1.0 | GHz— | 1 MB | HD 8210 | 128:8:4 | 300 MHz | — | DDR3L-1333 | 9 W | May 2013 | EM2100ICJ23HM | ||
E1-2500 | 1.4 | GHzHD 8240 | 400 MHz | DDR3L-1333 | 15 W | May 2013 | EM2500IBJ23HM | ||||||||
E2-3000 | 1.65 GHz | HD 8280 | 450 MHz | DDR3L-1600 | 15 W | May 2013 | EM3000IBJ23HM | ||||||||
A4-5000 | 4 | 1.5 | GHz2 MB | HD 8330 | 500 MHz | DDR3L-1600 | 15 W | May 2013 | AM5000IBJ44HM | ||||||
A6-5200 | 2.0 | GHzHD 8400 | 600 MHz | DDR3L-1600 | 25 W | May 2013 | AM5200IAJ44HM |
1 Unified shaders : Texture mapping units : Render output units
Puma (2014)
[edit]Mullins, Tablet/2-in-1 APU
[edit]Model | Stepping | CPU | GPU | Memory support |
TDP | Released | Part number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Frequency | Turbo | L2 Cache | Multi1 | Vcore | Model | Config2 | Frequency | Turbo | ||||||
E1 Micro-6200T | 2 | 1.0 GHz | 1.4 GHz | 1 MB | 0.50 – 1.40 V | R2 | 128:8:4 | 300 MHz | DDR3L-1066 | 3.95 W | Q2 2014 | EM620TIWJ23JB | |||
A4 Micro-6400T | 4 | 1.0 GHz | 1.6 GHz | 2 MB | R3 | 350 MHz | DDR3L-1333 | 4.5 W | Q2 2014 | AM640TIVJ44JB | |||||
A10 Micro-6700T | 1.2 GHz | 2.2 GHz | 2 MB | R6 | 500 MHz | DDR3L-1333 | 4.5 W | Q2 2014 | AM670TIVJ44JB |
Beema, Notebook APU
[edit]Model | Stepping | CPU | GPU | Memory support |
TDP | Released | Part number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Frequency | Turbo | L2 Cache | Multi1 | Vcore | Model | Config2 | Frequency | Turbo | ||||||
E1-6010 | 2 | 1.35 GHz | — | 1 MB | 0.50 – 1.40 V | R2 | 128:8:4 | 350 MHz | DDR3L-1333 | 10 W | Q2 2014 | EM6010IUJ23JB | |||
E2-6110 | 4 | 1.5 GHz | 2 MB | R2 | 500 MHz | DDR3L-1600 | 15 W | Q2 2014 | EM6110ITJ44JB | ||||||
A4-6210 | 1.8 GHz | R3 | 600 MHz | DDR3L-1600 | 15 W | Q2 2014 | AM6210ITJ44JB | ||||||||
A6-6310 | 1.8 GHz | 2.4 GHz | R4 | 800 MHz | DDR3L-1866 | 15 W | Q2 2014 | AM6310ITJ44JB | |||||||
A8-6410 | 2 GHz | 2.4 GHz | R5 | 800 MHz | DDR3L-1866 | 15 W | Q2 2014 |
AM6410ITJ44JB |
Kaveri (2014)
[edit]Model number | CPU | GPU | Memory support |
TDP | Socket | Released | Part number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Frequency | Turbo | L2 Cache | Multi | Vcore | Model | Config | Frequency | Turbo | ||||||
low power | |||||||||||||||
A6-7000 | 2 | 2.2 GHz | 3.0 GHz | 1 MB | 22× | R4 | 192:12:4 | 494 MHz | 533 MHz | DDR3-1333 | 17W | FP3 | June 2014 | AM7000ECH23JA | |
A6 Pro-7050B | 553 MHz | — | AM705BECH23JA | ||||||||||||
A8-7100 | 4 | 1.8 GHz | 3.0 GHz | 2× 2 MB | 18× | R5 | 256:16:4 | 450 MHz | 514 MHz | DDR3-1600 | 19W | FP3 | June 2014 | AM7100ECH44JA | |
A8 Pro-7150B | 1.9 GHz | 3.2 GHz | 19× | 553 MHz | — | AM715BECH44JA | |||||||||
A10-7300 | 1.9 GHz | 3.2 GHz | 19× | R6 | 384:24:8 | 464 MHz | 533 MHz | AM7300ECH44JA | |||||||
A10 Pro-7350B | 2.1 GHz | 3.3 GHz | 21× | 553 MHz | — | AM735BECH44JA | |||||||||
FX-7500 | 2.1 GHz | 3.3 GHz | 21× | R7 | 384:24:8 | 498 MHz | 533 MHz | FM7500ECH44JA | |||||||
standard power | |||||||||||||||
A8-7200P | 4 | 2.4 GHz | 3.3 GHz | 2× 2 MB | 24× | R5 | 256:16:4 | 553 MHz | 626 MHz | DDR3-1866 | 35W | FP3 | June 2014 | AM740PDGH44JA | |
A10-7400P | 2.5 GHz | 3.4 GHz | 25× | R6 | 384:24:8 | 576 MHz | 654 MHz | AM740PDGH44JA | |||||||
FX-7600P | 2.7 GHz | 3.6 GHz | 27× | R7 | 512:32:8 | 600 MHz | 686 MHz | DDR3-2133 | FM760PDGH44JA |
Carrizo-L (2015)
[edit]Model | Stepping | CPU | GPU | Memory support |
TDP | Released | Part number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Frequency | Turbo | L2 Cache | Multi1 | Vcore | Model | Config2 | Frequency | Turbo | ||||||
E1-7010 | 2 | 1.5 GHz | — | 1 MB | 0.50 – 1.40 V | R2 | 128:8:4 | 400 MHz | DDR3L-1333 | 10 W | May 2015 | EM7010IUJ23JB | |||
E2-7110 | 4 | 1.8 GHz | 2 MB | R2 | 600 MHz | DDR3L-1600 | 12-25 W | May 2015 | EM7110ITJ44JB | ||||||
A4-7210 | 1.8 GHz | 2.2 GHz | R3 | 686 MHz | DDR3L-1600 | 12-25 W | May 2015 | AM7210ITJ44JB | |||||||
A6-7310 | 2.0 GHz | 2.4 GHz | R4 | 800 MHz | DDR3L-1866 | 12-25 W | May 2015 | AM7310ITJ44JB | |||||||
A8-7410 | 2.2 GHz | 2.5 GHz | R5 | 847 MHz | DDR3L-1866 | 12-25 W | May 2015 | AM7410ITJ44JB |
Carrizo (2015)
[edit]Model number | CPU | GPU | Memory support |
TDP | Socket | Released | Part number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Frequency | Turbo | L2 Cache | Multi | Vcore | Model | Config | Frequency | Turbo | ||||||
standard power and low power (configurable TDP) | |||||||||||||||
A6-8500P | 2 | 1.6 GHz | 3.0 GHz | 1 MB | 16× | R5 | 256:16:4 | 800 MHz | — | DDR3-1600 | 12-35W | FP4 | June 2015 | AM850PAAY23KA | |
A6 PRO-8500B | 800 MHz | — | AM850BAAY23KA | ||||||||||||
A8-8600P | 4 | 1.6 GHz | 3.0 GHz | 2× 1 MB | 16× | R6 | 384:24:8 | 720 MHz | — | DDR3-2133 | 12-35W | FP4 | June 2015 | AM860PAAY43KA | |
A8 PRO-8600B | 1.6 GHz | 3.0 GHz | 16× | 720 MHz | — | AM860BAAY43KA | |||||||||
A10-8700P | 1.8 GHz | 3.2 GHz | 18× | R6 | 384:24:8 | 800 MHz | — | AM870PAAY43KA | |||||||
A10 Pro-8700B | 1.8 GHz | 3.2 GHz | 18× | 800 MHz | — | AM870BAAY43KA | |||||||||
FX-8800P | 2.1 GHz | 3.4 GHz | 21× | R7 | 512:32:8 | 800 MHz | — | FM880PAAY43KA | |||||||
A12 Pro-8800B | 2.1 GHz | 3.4 GHz | 21× | 800 MHz | — | FM880BAAY43KA |
Bristol Ridge (2016)
[edit]Model number | CPU | GPU | Memory support |
TDP | Socket | Released | Part number | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores | Frequency | Turbo | L2 Cache | Multi | Vcore | Model | Config | Frequency | Turbo | ||||||
standard power and low power (configurable TDP) | |||||||||||||||
A10-9600P | 4 | 2.4 GHz | 3.3 GHz | 2× 1 MB | R5 | 384:24:8 | 720 MHz | — | DDR4-1866 | 12–15W | FP4 | June 2016 | AM960PADY44AB | ||
A10-9600B PRO | — | October 2016 | AM960BADY44AB | ||||||||||||
A10-9630P | 2.6 GHz | 3.3 GHz | 800 MHz | — | DDR4-2400 | 25–45W | June 2016 | AM963PAEY44AB | |||||||
A10-9630B PRO | — | October 2016 | AM963BAEY44AB | ||||||||||||
A12-9700P | 2.5 GHz | 3.4 GHz | R7 | 384:24:8 | 758 MHz | — | DDR4-1866 | 12–15W | June 2016 | AM970PADY44AB | |||||
A12-9700B PRO | — | DDR4-1866 | October 2016 | AM970BADY44AB | |||||||||||
A12-9730P | 2.8 GHz | 3.5 GHz | 900 MHz | — | DDR4-2400 | 25–45W | June 2016 | AM973PAEY44AB | |||||||
A12-9730B PRO | — | October 2016 | AM973BAEY44AB | ||||||||||||
FX-9800P | 2.7 GHz | 3.6 GHz | 512:32:8 | 758 MHz | — | DDR4-1866 | 12–15W | June 2016 | FM980PADY44AB | ||||||
A12-9800B PRO | — | October 2016 | AM980BADY44AB | ||||||||||||
FX-9830P | 3.0 GHz | 3.7 GHz | 900 MHz | — | DDR4-2400 | 25–45W | June 2016 | FM983PAEY44AB | |||||||
A12-9830B PRO | — | October 2016 | AM983BAEY44AB |
"Raven Ridge" (2017)
[edit]Model | Release date |
Fab | CPU | GPU | Socket | PCIe lanes |
Memory support |
TDP | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | Cache | Model | Config[i] | Clock (MHz) |
Processing power (GFLOPS)[ii] | ||||||||||
Base | Boost | L1 | L2 | L3 | ||||||||||||
Athlon Pro 200U | 2019 | GloFo 14LP |
2 (4) | 2.3 | 3.2 | 64 KB inst. 32 KB data per core |
512 KB per core |
4 MB | Radeon Vega 3 | 192:12:4 3 CU |
1000 | 384 | FP5 | 12 (8+4) | DDR4-2400 dual-channel |
12–25 W |
Athlon 300U | Jan 6, 2019 | 2.4 | 3.3 | |||||||||||||
Ryzen 3 2200U | Jan 8, 2018 | 2.5 | 3.4 | 1100 | 422.4 | |||||||||||
Ryzen 3 3200U | Jan 6, 2019 | 2.6 | 3.5 | 1200 | 460.8 | |||||||||||
Ryzen 3 2300U | Jan 8, 2018 | 4 (4) | 2.0 | 3.4 | Radeon Vega 6 | 384:24:8 6 CU |
1100 | 844.8 | ||||||||
Ryzen 3 Pro 2300U | May 15, 2018 | |||||||||||||||
Ryzen 5 2500U | Oct 26, 2017 | 4 (8) | 3.6 | Radeon Vega 8 | 512:32:16 8 CU |
1126.4 | ||||||||||
Ryzen 5 Pro 2500U | May 15, 2018 | |||||||||||||||
Ryzen 5 2600H | Sep 10, 2018 | 3.2 | DDR4-3200 dual-channel |
35–54 W | ||||||||||||
Ryzen 7 2700U | Oct 26, 2017 | 2.2 | 3.8 | Radeon RX Vega 10 | 640:40:16 10 CU |
1300 | 1664 | DDR4-2400 dual-channel |
12–25 W | |||||||
Ryzen 7 Pro 2700U | May 15, 2018 | Radeon Vega 10 | ||||||||||||||
Ryzen 7 2800H | Sep 10, 2018 | 3.3 | Radeon RX Vega 11 | 704:44:16 11 CU |
1830.4 | DDR4-3200 dual-channel |
35–54 W |
- ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
"Picasso" (2019)
[edit]Common features of Ryzen 3000 notebook APUs:
- Socket: FP5.
- All the CPUs support DDR4-2400 in dual-channel mode.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 7 | 3780U[18] | 4 (8) | 2.3 | 4.0 | 4 MB | 1 × 4 | RX Vega 11 | 1.4 | 704:44:16 11 CU |
1971.2 | 15 W | Oct 2019 |
3750H[19] | RX Vega 10 | 640:40:16 10 CU[20] |
1792.0 | 35 W | Jan 6, 2019 | |||||||
3700C[21] | 15 W | Sep 22, 2020 | ||||||||||
3700U[a][22] | Jan 6, 2019 | |||||||||||
Ryzen 5 | 3580U[23] | 2.1 | 3.7 | Vega 9 | 1.3 | 576:36:16 9 CU |
1497.6 | Oct 2019 | ||||
3550H[24] | Vega 8 | 1.2 | 512:32:16 8 CU[25] |
1228.8 | 35 W | Jan 6, 2019 | ||||||
3500C[26] | 15 W | Sep 22, 2020 | ||||||||||
3500U[a][27] | Jan 6, 2019 | |||||||||||
3450U[28] | 3.5 | Jun 2020 | ||||||||||
Ryzen 3 | 3350U[29] | 4 (4) | Vega 6 | 384:24:8 6 CU[30] |
921.6 | Jan 6, 2019 | ||||||
3300U[a][31] |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
"Renoir" (2020)
[edit]U
[edit]Branding and model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (MHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 7 | 4980U | 8 (16) | 2.0 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics[a] |
1950 | 512:32:8 8 CU |
1996.8 | 15 W | Apr 13, 2021 |
4800U | 1.8 | 4.2 | 1750 | 1792 | Mar 16, 2020 | |||||||
Pro 4750U | 1.7 | 4.1 | 1600 | 448:28:8 7 CU |
1433.6 | May 7, 2020 | ||||||
4700U | 8 (8) | 2.0 | Mar 16, 2020 | |||||||||
Ryzen 5 | 4680U | 6 (12) | 2.1 | 4.0 | 2 × 3 | 1500 | 1344 | Apr 13, 2021 | ||||
Pro 4650U | 384:24:8 6 CU |
1152 | May 7, 2020 | |||||||||
4600U | Mar 16, 2020 | |||||||||||
4500U | 6 (6) | 2.3 | ||||||||||
Ryzen 3 | Pro 4450U | 4 (8) | 2.5 | 3.7 | 4 MB | 1 × 4 | 1400 | 320:20:8 5 CU |
896 | May 7, 2020 | ||
4300U | 4 (4) | 2.7 | Mar 16, 2020 |
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
H
[edit]Branding and model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (MHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 9 | 4900H | 8 (16) | 3.3 | 4.4 | 8 MB | 2 × 4 | Radeon Graphics[a] |
1750 | 512:32:8 8 CU |
1792 | 45 W | Mar 16, 2020 |
4900HS | 3.0 | 4.3 | 35 W | |||||||||
Ryzen 7 | 4800H | 2.9 | 4.2 | 1600 | 448:28:8 7 CU |
1433.6 | 45 W | |||||
4800HS | ||||||||||||
Ryzen 5 | 4600H | 6 (12) | 3.0 | 4.0 | 2 × 3 | 1500 | 384:24:8 6 CU |
1152 | ||||
4600HS[35][36][37] | 35 W |
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
"Lucienne" (2021)
[edit]Common features of Ryzen 5000 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Branding and Model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 7 | 5700U | 8 (16) | 1.8 | 4.3 | 8 MB | 2 × 4 | Radeon Graphics [a] |
1.9 | 512:32:8 8 CU |
1945.6 | 10–25 W | Jan 12, 2021 |
Ryzen 5 | 5500U[38] | 6 (12) | 2.1 | 4.0 | 2 × 3 | 1.8 | 448:28:8 7 CU |
1612.8 | ||||
Ryzen 3 | 5300U | 4 (8) | 2.6 | 3.8 | 4 MB | 1 × 4 | 1.5 | 384:24:8 6 CU |
1152 |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
"Cezanne" (2021)
[edit]U
[edit]Branding and model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (Threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 7 | 5800U[note 1][39] | 8 (16) | 1.9 | 4.4 | 16 MB | 1 × 8 | Radeon Graphics[a] |
2.0 | 512:32:8 8 CUs |
2048 | 10–25 W | Jan 12, 2021 |
Ryzen 5 | 5600U[note 1][40] | 6 (12) | 2.3 | 4.2 | 1 × 6 | 1.8 | 448:28:8 7 CUs |
1612.8 | ||||
5560U[41] | 4.0 | 8 MB | 1.6 | 384:24:8 6 CUs |
1228.8 | |||||||
Ryzen 3 | 5400U[note 1][42][43] | 4 (8) | 2.7 | 4.1 | 1 × 4 |
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
H
[edit]Branding and model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (Threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 9 | 5980HX[47] | 8 (16) | 3.3 | 4.8 | 16 MB | 1 × 8 | Radeon Graphics[a] |
2.1 | 512:32:8 8 CUs |
2150.4 | 35–54 W | Jan 12, 2021 |
5980HS[48] | 3.0 | 35 W | ||||||||||
5900HX[49] | 3.3 | 4.6 | 35–54 W | |||||||||
5900HS[50] | 3.0 | 35 W | ||||||||||
Ryzen 7 | 5800H[51][52] | 3.2 | 4.4 | 2.0 | 2048 | 35–54 W | ||||||
5800HS[53] | 2.8 | 35 W | ||||||||||
Ryzen 5 | 5600H[54][55] | 6 (12) | 3.3 | 4.2 | 1 × 6 | 1.8 | 448:28:8 7 CUs |
1612.8 | 35–54 W | |||
5600HS[56] | 3.0 | 35 W |
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
"Barceló" (2022)
[edit]Branding and model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (Threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 7 | 5825U[note 1][note 2][57] | 8 (16) | 2.0 | 4.5 | 16 MB | 1 × 8 | Radeon Graphics[a] |
2.0 | 512:32:8 8 CUs |
2048 | 15 W | Jan 4, 2022 |
Ryzen 5 | 5625U[note 1][note 2][58] | 6 (12) | 2.3 | 4.3 | 1 × 6 | 1.8 | 448:28:8 7 CUs |
1612.8 | ||||
Ryzen 3 | 5125C[59] | 2 (4) | 3.0 | — | 8 MB | 1 × 2 | ? | 192:12:8 3 CU |
? | May 5, 2022 |
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
"Rembrandt" (2022)
[edit]Common features of Ryzen 6000 notebook APUs:
- Socket: FP7, FP7r2.
- All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 4.0 lanes.
- Native USB 4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated RDNA 2 GPU.
- Fabrication process: TSMC N6 FinFET.
Branding and model | CPU | GPU | TDP | Release date | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | |||||
Base | Boost | |||||||||||
Ryzen 9 | 6980HX | 8 (16) | 3.3 | 5.0 | 16 MB | 1 × 8 | 680M | 2.4 | 768:48:8 12 CUs |
3686.4 | 45 W | Jan 4, 2022 [66] |
6980HS | 35 W | |||||||||||
6900HX[a] | 4.9 | 45 W | ||||||||||
6900HS[a] | 35 W | |||||||||||
Ryzen 7 | 6800H[a] | 3.2 | 4.7 | 2.2 | 3379.2 | 45 W | ||||||
6800HS[a] | 35 W | |||||||||||
6800U[a] | 2.7 | 15–28 W | ||||||||||
Ryzen 5 | 6600H[a] | 6 (12) | 3.3 | 4.5 | 1 × 6 | 660M | 1.9 | 384:24:8 6 CUs |
1459.2 | 45 W | ||
6600HS[a] | 35 W | |||||||||||
6600U[a] | 2.9 | 15–28 W |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Mendocino (7020 series, Zen2/RDNA2 based)
[edit]Common features of Ryzen 7020 notebook APUs:
- Socket: FT6
- All the CPUs support LPDDR5-5500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 4 PCIe 3.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 1
- Includes integrated RDNA 2 GPU.
- Fabrication process: TSMC N6 FinFET.
Branding and Model | CPU | GPU | TDP | Release date | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Processing power[ii] (GFLOPS) | |||||
Base | Boost | ||||||||||
Ryzen 5 | 7520U[iii] | 4 (8) | 2.8 | 4.3 | 4 MB | 1 × 4 | 610M 2 CU |
1.9 | 486.4 | 15 W | September 20, 2022[75] |
Ryzen 3 | 7320U[iii] | 2.4 | 4.1 |
Barcelo-R (7030 series, Zen3/GCN5 based)
[edit]Common features of Ryzen 7030 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC N7 FinFET.
Branding and Model | CPU | GPU | TDP | Release date | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[a] |
Model | Clock (GHz) |
Processing power[b] (GFLOPS) | |||||
Base | Boost | ||||||||||
Ryzen 7 | (PRO) 7730U | 8 (16) | 2.0 | 4.5 | 16 MB | 1 × 8 | Vega 8 CU |
2.0 | 2048 | 15 W | January 4, 2023 [78] |
Ryzen 5 | (PRO) 7530U | 6 (12) | 1 × 6 | Vega 7 CU |
1792 | ||||||
Ryzen 3 | (PRO) 7330U | 4 (8) | 2.3 | 4.3 | 8 MB | 1 × 4 | Vega 6 CU |
1.8 | 1382.4 |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Rembrandt-R (7035 series, Zen3+/RDNA2 based)
[edit]Common features of Ryzen 7035 notebook APUs:
- Socket: FP7, FP7r2.
- All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 4.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated RDNA 2 GPU.
- Fabrication process: TSMC N6 FinFET.
Branding and model | CPU | GPU | TDP | Release date[79] | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[a] |
Model | Clock (GHz) |
Processing power[b] (GFLOPS) | |||||
Base | Boost | ||||||||||
Ryzen 7 | 7735HS | 8 (16) | 3.2 | 4.75 | 16 MB | 1 × 8 | 680M 12 CU |
2.2 | 3379.2 | 35–54 W | April 30, 2023 |
7735H | |||||||||||
7736U | 2.7 | 4.7 | 15–28 W | January 4, 2023 | |||||||
7735U | 4.75 | 15–30 W | |||||||||
7435HS | 3.1 | 4.5 | — | 35–54 W | 2024[80] | ||||||
7435H | |||||||||||
Ryzen 5 | 7535HS | 6 (12) | 3.3 | 4.55 | 1 × 6 | 660M 6 CU |
1.9 | 1459.2 | April 30, 2023 | ||
7535H | |||||||||||
7535U | 2.9 | 15–30 W | January 4, 2023 | ||||||||
7235HS | 4 (8) | 3.2 | 4.2 | 8 MB | 1 × 4 | — | 35–53 W | 2024[81] | |||
7235H | |||||||||||
Ryzen 3 | 7335U | 3.0 | 4.3 | 660M 4 CU |
1.8 | 921.6 | 15–30 W | January 4, 2023 |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Phoenix (7040 series, Zen4/RDNA3 based)
[edit]Common features of Ryzen 7040 notebook APUs:
- Socket: FP7, FP7r2, FP8.
- All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All models support AVX-512 using a half-width 256-bit FPU.
- PCIe 4.0 support.
- Native USB 4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated RDNA 3 GPU.
- Includes XDNA AI Engine (Ryzen AI).
- Fabrication process: TSMC N4 FinFET.
Branding and model | CPU | GPU | NPU | PCIe (lanes) |
TDP | Release date[82] | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[a] |
Model | Clock (GHz) | |||||||||
Total | Zen 4 | Zen 4c | Base | Boost | ||||||||||
Ryzen 9 | (PRO) 7940HS | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU |
2.8 | Ryzen AI Up to 10 TOPS |
20 | 35–54 W | April 30, 2023[b] |
7940H[c] | ||||||||||||||
Ryzen 7 | (PRO) 7840HS | 3.8 | 5.1 | 2.7 | ||||||||||
7840H[c] | ||||||||||||||
(PRO) 7840U | 3.3 | 15–30 W | May 3, 2023[b] | |||||||||||
Ryzen 5 | (PRO) 7640HS | 6 (12) | 6 (12) | 4.3 | 5.0 | 1 × 6 | 760M 8 CU |
2.6 | 35–54 W | April 30, 2023[b] | ||||
7640H[c] | ||||||||||||||
(PRO) 7640U | 3.5 | 4.9 | 15–30 W | May 3, 2023[b] | ||||||||||
(PRO) 7545U | 2 (4) | 4 (8) | 3.7 / 3.0[d] | 4.9 / 3.5[e] | 2 + 4 | 740M 4 CU |
2.8 | No | 14 | November 2, 2023 | ||||
(PRO) 7540U | 6 (12) | — | 3.2 | 4.9 | 1 × 6 | 2.5 | May 3, 2023[b] | |||||||
Ryzen 3 | 7440U | 4 (8) | 1 (2) | 3 (6) | 3.6 / 2.8[d] | 4.7 / 3.3[e] | 8 MB | 1 + 3 |
- ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
- ^ a b c d e PRO versions launched on 13 June 2023.
- ^ a b c China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
- ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
- ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency
Dragon Range (7045 series, Zen4/RDNA2 based)
[edit]Common features of Ryzen 7045 notebook CPUs:
- Socket: FL1.
- All the CPUs support DDR5-5200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 28 PCIe 5.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 4
- Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
- Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
Branding and model | Cores (threads) |
Clock (GHz) | L3 cache (total) |
Chiplets | Core config[a] |
TDP | Release date[83] | ||
---|---|---|---|---|---|---|---|---|---|
Base | Boost | ||||||||
Ryzen 9 | 7945HX3D | 16 (32) | 2.3 | 5.4 | 128 MB[ii] | 2 × CCD 1 × I/OD |
2 × 8 | 55–75 W | July 27, 2023 |
7945HX | 2.5 | 64 MB | February 28, 2023 | ||||||
7940HX | 2.4 | 5.2 | January 17, 2024 | ||||||
7845HX | 12 (24) | 3.0 | 5.2 | 2 × 6 | 45–75 W | February 28, 2023 | |||
Ryzen 7 | 7840HX | 2.9 | 5.1 | January 17, 2024 | |||||
7745HX | 8 (16) | 3.6 | 5.1 | 32 MB | 1 × CCD 1 × I/OD |
1 × 8 | February 28, 2023 | ||
Ryzen 5 | 7645HX | 6 (12) | 4.0 | 5.0 | 1 × 6 |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
- ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.
See also
[edit]References
[edit]- ^ "The AMD Sempron Processor Model 2100+ Enabling Fanless Designs for Embedded Systems", www.amd.com, May 30, 2007.
- ^ a b c d e f g h i j k l m "AMD Turion X2/Turion X2 Ultra". Amd.com. 2014-03-12. Retrieved 2014-04-30.
- ^ AMD Notebook CPU comparison page Archived 2010-05-27 at the Wayback Machine, retrieved January 15, 2009
- ^ "AMD Processors for Notebooks: AMD Turion 64 X2 Mobile Technology, AMD Athlon 64 X2 Dual-Core, Mobile AMD Sempron Processor". Archived from the original on 2009-05-07. Retrieved 2009-11-05.
- ^ "2nd Gen AMD Ultrathin Platform". Amd.com. Retrieved 2014-04-30.
- ^ a b c d e "The 2009 AMD Mainstream Platform". Amd.com. Retrieved 2014-04-30.
- ^ a b "AMD M880G Chipset". Amd.com. Retrieved 2014-04-30.
- ^ a b "The 2010 AMD Ultrathin Platform". Amd.com. Retrieved 2014-04-30.
- ^ a b "Mehr Leistung: Triple- und Quadcores für Notebooks – AMD Vision – neue Notebook-Plattformen Danube und Nile". Chip.de. 2010-05-12. Retrieved 2014-04-30.
- ^ a b c d e f g h i j "The 2010 AMD Mainstream Platform". Amd.com. Retrieved 2014-04-30.
- ^ Welcome | AMD Blogs
- ^ "A closer look at AMD's Brazos platform". Techreport.com. 2010-11-08. Retrieved 2014-04-30.
- ^ The AMD Fusion Family of APUs Archived November 25, 2010, at the Wayback Machine
- ^ "AMD Fusion APU Era Begins". Amd.com. Retrieved 2014-04-30.
- ^ "2011 AMD Notebook Platform". Amd.com. Retrieved 2014-04-30.
- ^ "AMD intros 35W Richland mobile APUs". The Tech Report. 2013-03-12. Retrieved 2014-04-30.
- ^ Poeter, Damon (2013-03-12). "AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion". PCMag.com. Retrieved 2014-04-30.
- ^ "AMD Ryzen 7 3780U Microsoft Surface® Edition".
- ^ "AMD Ryzen 7 3750H Mobile Processor with Radeon RX Vega 10 Graphics".
- ^ "AMD Radeon RX Vega 10 Mobile Specs | TechPowerUp GPU Database". Techpowerup.com.
- ^ "AMD Ryzen 7 3700C".
- ^ "AMD Ryzen 7 3700U Mobile Processor with Radeon RX Vega 10 Graphics".
- ^ "AMD Ryzen 5 3580U Microsoft Surface® Edition".
- ^ "AMD Ryzen 5 3550H Mobile Processor with Radeon Vega 8 Graphics". Retrieved 8 January 2018.
- ^ "AMD Radeon Vega 8 Specs | TechPowerUp GPU Database". Techpowerup.com.
- ^ "AMD Ryzen 5 3500C".
- ^ "AMD Ryzen 5 3500U Mobile Processor with Radeon Vega 8 Graphics".
- ^ "AMD Ryzen 5 3450U Processor".
- ^ "AMD Ryzen 3 3350U". AMD.
- ^ "AMD Radeon Vega 6 Mobile Specs | TechPowerUp GPU Database". Techpowerup.com.
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