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List of AMD mobile processors

From Wikipedia, the free encyclopedia

Features overview

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CPUs

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APUs

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APU features table

Initial platform (2003)

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Launched in 2003, the initial platform for mobile AMD processors consists of:

AMD mobile Initial platform
Mobile processor Processors – Socket 754
Mobile chipset D-sub and HyperTransport 1.0

Mobile Sempron

[edit]

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.95 – 1.4 V 13 – 62 W July 28, 2004 SMN2600BIX2AY
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.95 – 1.4 V 13 – 62 W July 28, 2004 SMN2800BIX3AY
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 – 1.4 V 13 – 62 W July 28, 2004 SMN3000BIX2AY

"Dublin" (Socket 754, CG, 130 nm, Low power)

[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.975 – 1.25 V 9 – 25 W July 28, 2004 SMS2600BOX2LA
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.975 – 1.25 V 9 – 25 W July 28, 2004 SMS2800BOX3LA

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 08x 0.95 – 1.4 V 62 W July 2004 SMN2600BIX2BA
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 08x 0.95 – 1.4 V 62 W July 2004 SMN2800BIX3BA
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 09x 0.95 – 1.4 V 62 W July 2004 SMN3000BIX2BA
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 09x 0.95 – 1.4 V 62 W May 3, 2005 SMN3100BIX3BA
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 – 1.4 V 62 W August 19, 2005 SMN3300BIX2BA

"Sonora" (Socket 754, D0, 90 nm, Low power)

[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.975 – 1.25 V 25 W July 2004 SMS2600BOX2LB
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.975 – 1.25 V 25 W July 2004 SMS2800BOX3LB
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.975 – 1.25 V 25 W November 23, 2004 SMS3000BOX2LB
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.975 – 1.25 V 25 W January 2005 SMS3100BOX3LB

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 – 1.4 V 62 W July 15, 2005 SMN3000BIX2BX
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.95 – 1.4 V 62 W July 15, 2005 SMN3100BIX3BX
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 – 1.4 V 62 W July 15, 2005 SMN3300BIX2BX
Mobile Sempron 3400+ 2000 MHz 256 kB 800 MHz 10x 0.95 – 1.4 V 62 W January 23, 2006 SMN3400BIX3BX
Mobile Sempron 3600+ 2200 MHz 128 kB 800 MHz 11x 0.95 – 1.4 V 62 W May 17, 2006 SMN3600BIX2BX

"Roma" (Socket 754, E6, 90 nm, Low power)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 08x 0.95 – 1.2 V 25 W July 15, 2005 SMS2800BQX3LF
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 09x 0.95 – 1.2 V 25 W July 15, 2005 SMS3000BQX2LE
SMS3000BQX2LF
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 09x 0.95 – 1.2 V 25 W July 15, 2005 SMS3100BQX3LE
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 – 1.2 V 25 W July 2005 SMS3300BQX2LE
Mobile Sempron 3400+ 2000 MHz 256 kB 800 MHz 10x 0.95 – 1.2 V 25 W May 17, 2006 SMS3400BQX3LE

Mobile Athlon 64

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"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8x 1.50 V 19 – 81.5 W Socket 754 May 2004 AMA2700BEY4AP (C0)
Mobile Athlon 64 2800+ 1600 MHz 1024 kB 800 MHz 8x 1.50 V 19 – 81.5 W Socket 754 February 2004 AMA2800BEX5AP (C0)
AMA2800BEX5AR (CG)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3000BEX5AP (C0)
AMA3000BEX5AR (CG)
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3200BEX5AP (C0)
AMA3200BEX5AR (CG)
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3400BEX5AP (C0)
AMA3400BEX5AR (CG)
Mobile Athlon 64 3700+ 2400 MHz 1024 kB 800 MHz 12x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3700BEX5AP (C0)
AMA3700BEX5AR (CG)

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

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MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2800+ 1600 MHz 1024 kB 800 MHz 8x 1.40 V 62 W Socket 754 September 2003 AMN2800BIX5AP (C0)
AMN2800BIX5AR (CG)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9x 1.40 V 62 W Socket 754 September 2003 AMN3000BIX5AP (C0)
AMN3000BIX5AR (CG)
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10x 1.40 V 62 W Socket 754 September 2003 AMN3200BIX5AP (C0)
AMN3200BIX5AR (CG)
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11x 1.40 V 62 W Socket 754 February 2004 AMN3400BIX5AR (CG)

"ClawHammer" (CG, 130 nm, 35 W TDP)

[edit]

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8x 1.20 V 35 W Socket 754 May 2004 AMD2700BQX4AR

"Odessa" (CG, 130 nm, Desktop replacement)

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MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 8x 1.50 V 19 – 81.5 W Socket 754 April 2004 AMA2800BEX4AX

"Odessa" (CG, 130 nm, 35 W TDP)

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MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 1.20 V 35 W Socket 754 May 2004 AMD2700BQX4AX
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 1.20 V 35 W Socket 754 May 2004 AMD2800BQX4AX
Mobile Athlon 64 3000+ 2000 MHz 512 kB 800 MHz 10× 1.20 V 35 W Socket 754 May 2004 AMD3000BQX4AX

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

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MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 1.35 V 35 W Socket 754 August 17, 2004 AMD2700BKX4LB
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 1.35 V 35 W Socket 754 August 17, 2004 AMD2800BKX4LB
Mobile Athlon 64 3000+ 2000 MHz 512 kB 800 MHz 10× 1.35 V 35 W Socket 754 August 17, 2004 AMD3000BKX4LB

"Newark" (E5, 90 nm, 62 W TDP)

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MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 0 1.35 V 62 W Socket 754 April 14, 2005 AMN3000BKX5BU
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10× 1.35 V 62 W Socket 754 April 14, 2005 AMN3200BKX5BU
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11× 1.35 V 62 W Socket 754 April 14, 2005 AMN3400BKX5BU
Mobile Athlon 64 3700+ 2400 MHz 1024 kB 800 MHz 12× 1.35 V 62 W Socket 754 April 14, 2005 AMN3700BKX5BU
Mobile Athlon 64 4000+ 2600 MHz 1024 kB 800 MHz 13× 1.35 V 62 W Socket 754 August 16, 2005 AMN4000BKX5BU

Turion 64

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"Lancaster" (90 nm)

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MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 ML-28 1600 MHz 0512 kB 800 MHz 08x 1.35 V 35 W Socket 754 June 22, 2005 TMDML28BKX4LD
Turion 64 ML-30 1600 MHz 1024 kB 800 MHz 08x 1.35 V 35 W Socket 754 March 10, 2005 TMDML30BKX5LD
Turion 64 ML-32 1800 MHz 0512 kB 800 MHz 09x 1.35 V 35 W Socket 754 March 10, 2005 TMDML32BKX4LD
Turion 64 ML-34 1800 MHz 1024 kB 800 MHz 09x 1.35 V 35 W Socket 754 March 10, 2005 TMDML34BKX5LD
Turion 64 ML-37 2000 MHz 1024 kB 800 MHz 10x 1.35 V 35 W Socket 754 March 10, 2005 TMDML37BKX5LD
Turion 64 ML-40 2200 MHz 1024 kB 800 MHz 11x 1.35 V 35 W Socket 754 June 22, 2005 TMDML40BKX5LD
Turion 64 ML-42 2400 MHz 0512 kB 800 MHz 12x 1.35 V 35 W Socket 754 October 4, 2005 TMDML42BKX4LD
Turion 64 ML-44 2400 MHz 1024 kB 800 MHz 12x 1.35 V 35 W Socket 754 January 4, 2006 TMDML44BKX5LD
Turion 64 MT-28 1600 MHz 0512 kB 800 MHz 08x 1.20 V 25 W Socket 754 June 22, 2005 TMSMT28BQX4LD
Turion 64 MT-30 1600 MHz 1024 kB 800 MHz 08x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT30BQX5LD
Turion 64 MT-32 1800 MHz 0512 kB 800 MHz 09x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT32BQX4LD
Turion 64 MT-34 1800 MHz 1024 kB 800 MHz 09x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT34BQX5LD
Turion 64 MT-37 2000 MHz 1024 kB 800 MHz 10x 1.20 V 25 W Socket 754 August 8, 2005 TMSMT37BQX5LD
Turion 64 MT-40 2200 MHz 1024 kB 800 MHz 11x 1.20 V 25 W Socket 754 August 8, 2005 TMSMT40BQX5LD

Kite platform (2006)

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Introduced in 2006, the Kite platform consists of:

AMD mobile Kite platform
Mobile processor Processors – Socket S1
  • Mobile Sempron single-core 64-bit processor (codenamed Keene), or
  • Turion 64 single-core 64-bit processor (codenamed Richmond), or
  • Turion 64 X2 dual-core 64-bit processor (codenamed Taylor, Trinidad)
Mobile chipset
Mobile support

Mobile Sempron

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"Keene" (Socket S1, F2, 90 nm, Low power)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 3200+ 1600 MHz 512 kB 800 MHz 08x 0.950 – 1.125 V 25 W May 17, 2006 SMS3200HAX4CM
Mobile Sempron 3400+ 1800 MHz 256 kB 800 MHz 09x 0.950 – 1.125 V 25 W May 17, 2006 SMS3400HAX3CM
Mobile Sempron 3500+ 1800 MHz 512 kB 800 MHz 09x 0.950 – 1.125 V 25 W May 17, 2006 SMS3500HAX4CM
Mobile Sempron 3600+ 2000 MHz 256 kB 800 MHz 10x 0.950 – 1.125 V 25 W Oct 23, 2006 SMS3600HAX3CM

Turion 64

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"Richmond" (90 nm)

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MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 MK-36 2000 MHz 512 kB 800 MHz 10x 1.15 V 31 W Socket S1 September 1, 2006 TMDMK36HAX4CM
Turion 64 MK-38 2200 MHz 512 kB 800 MHz 11x 1.15 V 31 W Socket S1 Q1 2007 TMDMK38HAX4CM

Turion 64 X2

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"Taylor" (90 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-50 1600 MHz 2 × 256 kB 800 MHz 8x 0.8 – 1.10 V 31 W Socket S1 May 17, 2006 TMDTL50HAX4CT

"Trinidad" (90 nm)

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MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-52 1600 MHz 2 × 512 kB 800 MHz 08x 0.8 – 1.125 V 31 W Socket S1 May 17, 2006 TMDTL52HAX5CT
Turion 64 X2 TL-56 1800 MHz 2 × 512 kB 800 MHz 09x 0.8 – 1.125 V 33 W Socket S1 May 17, 2006 TMDTL56HAX5CT
Turion 64 X2 TL-60 2000 MHz 2 × 512 kB 800 MHz 10x 0.8 – 1.125 V 35 W Socket S1 May 17, 2006 TMDTL60HAX5CT
Turion 64 X2 TL-64 2200 MHz 2 × 512 kB 800 MHz 11x 0.8 – 1.125 V 35 W Socket S1 January 30, 2007 TMDTL64HAX5CT

Kite Refresh platform (2007)

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AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

AMD mobile Kite Refresh platform
Mobile processor Processors – Socket S1
  • Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or
  • Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman)
Mobile chipset
  • HDMI, HyperTransport 1.0 and PCI Express 1.0
  • DDR2-800 SO-DIMM
Mobile support

Mobile Sempron

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"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Sempron 2100+ fanless[1] 1000 MHz 256 kB 800 MHz 5x 0.950 – 1.125 V 09 W May 30, 2007 SMF2100HAX3DQE (G1)
Mobile Sempron 3600+ 2000 MHz 256 kB 800 MHz 10x 25 W SMS3600HAX3DN (G2)
Mobile Sempron 3700+ 2000 MHz 512 kB 800 MHz 10x 25 W SMS3700HAX4DQE (G1)
Mobile Sempron 3800+ 2200 MHz 256 kB 800 MHz 11x 31 W SMD3800HAX3DN (G2)
Mobile Sempron 4000+ 2200 MHz 512 kB 800 MHz 11x 31 W SMD4000HAX4DN (G2)

Athlon 64 X2

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"Tyler" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon 64 X2 TK-42 1600 MHz 2 × 512 kB 800 MHz 8.0x 1.075/1.10/1.125 V 20 W Socket S1 AMETK42HAX5DM
Athlon 64 X2 TK-53 1700 MHz 2 × 256 kB 800 MHz 8.5x 1.075/1.10/1.125 V 31 W Socket S1 August 20, 2007 AMDTK53HAX4DC
Athlon 64 X2 TK-55 1800 MHz 2 × 256 kB 800 MHz 9.0x 1.075/1.10/1.125 V 31 W Socket S1 Aug 20 2007 AMDTK55HAX4DC
Athlon 64 X2 TK-57 1900 MHz 2 × 256 kB 800 MHz 9.5x 1.075/1.10/1.125 V 31 W Socket S1 2008 AMDTK57HAX4DM

Turion 64 X2

[edit]

"Tyler" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-56 1800 MHz 2 × 512 kB 800 MHz 09.0x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL56HAX5DC
Turion 64 X2 TL-58 1900 MHz 2 × 512 kB 800 MHz 09.5x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL58HAX5DC
Turion 64 X2 TL-60 2000 MHz 2 × 512 kB 800 MHz 10.0x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL60HAX5DC
Turion 64 X2 TL-62 2100 MHz 2 × 512 kB 800 MHz 10.5x 1.075/1.10/1.125 V 35 W Socket S1 Jan 21 2008 TMDTL62HAX5DM
Turion 64 X2 TL-64 2200 MHz 2 × 512 kB 800 MHz 11.0x 1.075/1.10/1.125 V 35 W Socket S1 May 7, 2007 TMDTL64HAX5DC
Turion 64 X2 TL-66 2300 MHz 2 × 512 kB 800 MHz 11.5x 1.075/1.10/1.125 V 35 W Socket S1 May 7, 2007
Jul 10 2007
TMDTL66HAX5DC
TMDTL66HAX5DM
Turion 64 X2 TL-68 2400 MHz 2 × 512 kB 800 MHz 12.0x 1.075/1.10/1.125 V 35 W Socket S1 December 19, 2007 TMDTL68HAX5DM

Puma platform (2008)

[edit]

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit codenamed Griffin of processors, named "Turion X2 Ultra", or
  • Mobile Sempron single-core 64-bit processor (codenamed Sable), with the following:
    • Split-power planes and linked power management support
    • Support for possible low voltage processors
Mobile chipset AMD M780 series chipset
Mobile support
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter
  • Hybrid hard drives
  • Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (DASH page)
  • Trusted Platform Module (TPM) support

Mobile Sempron

[edit]

"Sable" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Sempron SI-40 2000 MHz 512 kB 1800 MHz 10.0x 1.075 – 1.125 V 25 W Socket S1G2 June 4, 2008 SMSI40SAM12GG
Sempron SI-42 2100 MHz 512 kB 1800 MHz 10.5x 1.075 – 1.125 V 25 W Socket S1G2 Q3 2008 SMSI42SAM12GG

Athlon X2

[edit]

"Lion" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon X2 QL-60 1900 MHz 2 × 512 kB 1800 MHz 09.5x 0.95 – 1.1 V 35 W Socket S1G2 June 4, 2008 AMQL60DAM22GG
Athlon X2 QL-62 2000 MHz 2 × 512 kB 1800 MHz 10.0x 0.95 – 1.1 V 35 W Socket S1G2 Q3 2008 AMQL62DAM22GG
Athlon X2 QL-64 2100 MHz 2 × 512 kB 1800 MHz 10.5x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL64DAM22GG
Athlon X2 QL-65 2100 MHz 2 × 512 kB 2000 MHz 10.5x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL65DAM22GG
Athlon X2 QL-66 2200 MHz 2 × 512 kB 1800 MHz 11.0x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL66DAM22GG
Athlon X2 QL-67 2200 MHz 2 × 512 kB 2000 MHz 11.0x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL67DAM22GG

Turion X2

[edit]

"Lion" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion X2 RM-70[2] 2000 MHz 2 × 512 kB 1800 MHz 10x 0.75 – 1.2 V 31 W Socket S1G2 June 4, 2008 TMRM70DAM22GG
Turion X2 RM-72[2] 2100 MHz 2 × 512 kB 1800 MHz 10.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMRM72DAM22GG
Turion X2 RM-74[2] 2200 MHz 2 × 512 kB 1800 MHz 11.0x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM74DAM22GG
Turion X2 RM-75[2] 2200 MHz 2 × 512 kB 2000 MHz 11.0x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM75DAM22GG
Turion X2 RM-76[2] 2300 MHz 2 × 512 kB 1800 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM76DAM22GG
Turion X2 RM-77[2] 2300 MHz 2 × 512 kB 2000 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM77DAM22GG

Turion X2 Ultra

[edit]

"Lion" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion X2 Ultra ZM-80[2] 2100 MHz 2 × 1 MB 1800 MHz 10.5x 0.75 – 1.2 V 32 W Socket S1G2 June 4, 2008 TMZM80DAM23GG
Turion X2 Ultra ZM-82[2] 2200 MHz 2 × 1 MB 1800 MHz 11.0x 0.75 – 1.2 V 35 W Socket S1G2 June 4, 2008 TMZM82DAM23GG
Turion X2 Ultra ZM-84[2] 2300 MHz 2 × 1 MB 1800 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM84DAM23GG
Turion X2 Ultra ZM-85[2] 2300 MHz 2 × 1 MB 2200 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM85DAM23GG
Turion X2 Ultra ZM-86[2] 2400 MHz 2 × 1 MB 1800 MHz 12.0x 0.75 – 1.2 V 35 W Socket S1G2 June 4, 2008 TMZM86DAM23GG
Turion X2 Ultra ZM-87[2] 2400 MHz 2 × 1 MB 2200 MHz 12.0x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM87DAM23GG
Turion X2 Ultra ZM-88[2] 2500 MHz 2 × 1 MB 1800 MHz 12.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM88DAM23GG

Yukon platform (2009)

[edit]

The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single-core 64-bit codenamed Huron of processors, named "Athlon Neo", or
  • Mobile Sempron single-core 64-bit processor (codenamed Huron), with the following:
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
Mobile chipset AMD RS690E series chipset + SB600 southbridge
Mobile support
  • Wireless connectivity with 3G (as option)
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter

Sempron

[edit]

"Huron" (65 nm, Low power)

[edit]
  • Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
  • Sempron 210U supports extra AMD-V
Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Package/Socket Release date Order Part Number
Sempron 200U[3] 1000 MHz 256 kB 1600 MHz 5x 0.925 V 8 W Socket ASB1 January 8, 2009 SMF200UOAX3DV
Sempron 210U 1500 MHz 256 kB 1600 MHz 7.5x 0.925 V 15 W Socket ASB1 January 8, 2009 SMG210UOAX3DX

Athlon Neo

[edit]

"Huron" (65 nm, 15 W TDP)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Neo MV-40 1600 MHz 512 kB 800 MHz 8x 1.1 V 15 W Socket ASB1 January 8, 2009 AMGMV40OAX4DX

"Sherman" (65 nm, 15 W TDP)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Neo TF-20 1600 MHz 512 kB 800 MHz 8x 1.0 V 15 W Socket S1 January 8, 2009 AMGTF20HAX4DN

"Congo" (65 nm, 13 W TDP)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Mobile X2 L310 1200 MHz 2 × 512 kB 800 MHz 6x 0.925 V 13 W Socket S1 January 8, 2009 AMML310HAX5DM

Turion

[edit]

"Congo" (65 nm, 20 W TDP)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Turion Mobile X2 L510 1600 MHz 2 × 512 kB 800 MHz 8x 0.925 V 20 W Socket S1 January 8, 2009 TMEL510HAX5DM

Congo platform (2009)

[edit]

The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Conesus, with the following:
    • made on 65 nm process
    • 15 W (single-core) or 18 W (dual-core) TDP
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
    • DDR2 SO-DIMM
Mobile chipset AMD M780G(RS780M) series chipset + SB710 southbridge

Athlon Neo X2

[edit]

"Conesus" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon Neo X2 L325 1500 MHz 2 × 512 kB 800 MHz 7.5x 0.925 V 18 W Socket ASB1 August 10, 2009 AMZL325OAX5DY
Athlon Neo X2 L335 1600 MHz 2 × 512 kB 800 MHz 8.0x 0.925 V 18 W Socket ASB1 February 2010 AMZL335OAX5DY

Turion Neo X2

[edit]

"Conesus" (65 nm)

[edit]

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion Neo X2 L625 1600 MHz 2 × 512 kB 800 MHz 8x 0.925 V 18 W Socket ASB1 August 10, 2009 TMZL625OAX5DY

Tigris platform (2009)

[edit]

The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Caspian, with the following:
    • made on 45 nm process
    • 25 W (single-core) or 35 W (dual-core) TDP
Mobile chipset AMD M785(RS880M) series chipset + SB710 southbridge

Sempron

[edit]

"Caspian" (45 nm)

[edit]

Single-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache FPU width[6] HT Mult. Voltage TDP Socket Release date Order Part Number
Sempron M100 2000 MHz 512 kB 64-bit 1600 MHz 10.0x 25 W Socket S1G3 September 10, 2009 SMM100SBO12GQ
Sempron M120 2100 MHz 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G3 September 10, 2009 SMM120SBO12GQ
Sempron M140 2200 MHz 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G3 April 2010 SMM140SBO12GQ


Athlon II

[edit]

"Caspian" (45 nm)

[edit]

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model number Frequency L2 cache FPU width[6] HT Mult. TDP Socket Release date Part number
Athlon II M300 2.0 GHz 2 × 512 kB 64-bit 1.6 GHz 10× 35 W Socket S1G3 September 10, 2009 AMM300DBO22GQ
Athlon II M320 2.1 GHz 2 × 512 kB 64-bit 1.6 GHz 10.5× 35 W Socket S1G3 September 10, 2009 AMM320DBO22GQ
Athlon II M340 2.2 GHz 2 × 512 kB 64-bit 1.6 GHz 11× 35 W Socket S1G3 September 10, 2009 AMM340DBO22GQ
Athlon II M360 2.3 GHz 2 × 512 kB 64-bit 1.6 GHz 11× 35 W Socket S1G3 May 2010 AMM360DBO22GQ


Turion II

[edit]

"Caspian" (45 nm)

[edit]

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model number Clock
speed
L2 cache FPU width[6] Hyper
Transport
Multi TDP Socket Release date Part number
Turion II M500 2.2 GHz 2 × 512 KB 128-bit 1.8 GHz 11× 35 W Socket S1G3 September 10, 2009 TMM500DBO22GQ
Turion II M520 2.3 GHz 2 × 512 KB 128-bit 1.8 GHz 11.5× 35 W Socket S1G3 September 10, 2009 TMM520DBO22GQ
Turion II M540 2.4 GHz 2 × 512 KB 128-bit 1.8 GHz 12× 35 W Socket S1G3 September 10, 2009 TMM540DBO22GQ
Turion II M560 2.5 GHz 2 × 512 KB 128-bit 1.8 GHz 12× 35 W Socket S1G3 April 2010 TMM560DBO22GQ


Turion II (Ultra)

[edit]

"Caspian" (45 nm)

[edit]

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model number Clock
speed
L2 cache FPU width[6] Hyper
Transport
Multi TDP Socket Release date Part number
Turion II Ultra M600 2.4 GHz 2 × 1 MB 128-bit 1.8 GHz 12× 35 W Socket S1G3 September 10, 2009 TMM600DBO23GQ
Turion II Ultra M620 2.5 GHz 2 × 1 MB 128-bit 1.8 GHz 12.5× 35 W Socket S1G3 September 10, 2009 TMM620DBO23GQ
Turion II Ultra M640 2.6 GHz 2 × 1 MB 128-bit 1.8 GHz 13× 35 W Socket S1G3 September 10, 2009 TMM640DBO23GQ
Turion II Ultra M660 2.7 GHz 2 × 1 MB 128-bit 1.8 GHz 13.5× 35 W Socket S1G3 September 10, 2009 TMM660DBO23GQ


Nile platform (2010)

[edit]

The Nile platform [7][8] introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Geneva, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 9 W, 12 W or 15 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

V series

[edit]

"Geneva" (45 nm)

[edit]

Single-core mobile processor

Model
number
Clock
speed
L2 cache FPU width[8] Hyper
Transport
Multi TDP Socket Release date Part number
V105 1.2 GHz 512 KB 64-bit 1.0 GHz 9 W ASB2 May 12, 2010 VMV105FDV12GM


Athlon II Neo

[edit]

"Geneva" (45 nm)

[edit]

Single-core mobile processor Single-core mobile processor

Model number Frequency L2 Cache FPU width[10] HT Mult. TDP Socket Release date Order Part Number
Athlon II Neo K125 1.7 GHz 1 MB 64-bit 1.0 GHz 8.5× 12 W ASB2 May 12, 2010 AMK125LAV13GM
Athlon II Neo K145 1.8 GHz 1 MB 64-bit 1.0 GHz 12 W ASB2 January 4, 2011 AMK145LAV13GM

Dual-core mobile processor

Model number Frequency L2 Cache FPU width[10] HT Mult. TDP Socket Release date Order Part Number
Athlon II Neo N36L 1.3 GHz 2 × 1 MB 64-bit 1.0 GHz 6.5× 12 W ASB2 April 26, 2010 AEN36LLAV23GME
Athlon II Neo K325 1.3 GHz 2 × 1 MB 64-bit 1.0 GHz 6.5× 12 W ASB2 May 12, 2010 AMK325LAV23GM
Athlon II Neo K345 1.4 GHz 2 × 1 MB 64-bit 1.0 GHz 12 W ASB2 January 4, 2011 AMK345LAV23GM


Turion II Neo

[edit]

"Geneva" (45 nm)

[edit]

Dual-core mobile processor

Model number Clock
speed
L2 cache FPU width[10] Hyper
Transport
Multi TDP Socket Release date Part number
Turion II Neo N40L 1.5 GHz 2 × 1 MB 128-bit 1.6 GHz 7.5× 15 W Socket ASB2 April 26, 2010 TEN40LGAV23GME
Turion II K625 1.5 GHz 2 × 1 MB 128-bit 1.6 GHz 7.5× 15 W Socket ASB2 May 12, 2010 TMK625GAV23GM
Turion II K645 1.6 GHz 2 × 1 MB 128-bit 1.6 GHz 15 W Socket ASB2 January 4, 2011 TMK645GAV23GM
Turion II K665 1.7 GHz 2 × 1 MB 128-bit 1.6 GHz 8.5× 15 W Socket ASB2 May 12, 2010 TMK665GAV23GM
Turion II K685 1.8 GHz 2 × 1 MB 128-bit 1.6 GHz 15 W Socket ASB2 January 4, 2011 TMK685GAV23GM
Turion II Neo N54L 2.2 GHz 2 × 1 MB 128-bit 1.6 GHz 11× 25 W Socket ASB2 May 2010 TEN54LSDV23GME


Danube platform (2010)

[edit]

The Danube platform[7][10] introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single, Dual, Triple or Quad-core 64-bit processors codenamed Champlain, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 25, 35 or 45 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

[edit]

Champlain (45 nm)

[edit]

Single-core mobile processor

Model
number
Clock
speed
L2 cache FPU width[10] Hyper
Transport
Multi TDP Socket Release date Part number
V120 2.2 GHz 512 KB 64-bit 1.6 GHz 11× 25 W S1G4 May 12, 2010 VMV120SGR12GM
V140 2.3 GHz 512 KB 64-bit 1.6 GHz 11.5× 25 W S1G4 October 4, 2010 VMV140SGR12GM
V160 2.4 GHz 512 KB 64-bit 1.6 GHz 12× 25 W S1G4 January 4, 2011 VMV160SGR12GM


Athlon II

[edit]

Champlain (45 nm)

[edit]

Dual-core mobile processor

Model Number Frequency L2 cache FPU width[10] HT Mult. TDP Socket Release date Order Part Number
Athlon II P320 2.1 GHz 2 × 512 KB 64-bit 1.6 GHz 10.5× 25 W Socket S1G4 May 12, 2010 AMP320SGR22GM
Athlon II P340 2.2 GHz 2 × 512 KB 64-bit 1.6 GHz 11× 25 W Socket S1G4 October 4, 2010 AMP340SGR22GM
Athlon II P360 2.3 GHz 2 × 512 KB 64-bit 1.6 GHz 11.5× 25 W Socket S1G4 January 4, 2011 AMP360SGR22GM
Athlon II N330 2.3 GHz 2 × 512 KB 64-bit 1.6 GHz 11.5× 35 W Socket S1G4 May 12, 2010 AMN330DCR22GM
Athlon II N350 2.4 GHz 2 × 512 KB 64-bit 1.6 GHz 12× 35 W Socket S1G4 October 4, 2010 AMN350DCR22GM
Athlon II N370 2.5 GHz 2 × 512 KB 64-bit 1.6 GHz 12.5× 35 W Socket S1G4 January 4, 2011 AMN370DCR22GM


Turion II

[edit]

Champlain (45 nm)

[edit]

Dual-core mobile processor

Model number Clock
speed
L2 cache FPU width[10] Hyper
Transport
Multi TDP Socket Release date Part number
Turion II P520 2.3 GHz 2 × 1 MB 128-bit 1.8 GHz 11.5× 25 W Socket S1G4 May 12, 2010 TMP520SGR23GM
Turion II P540 2.4 GHz 2 × 1 MB 128-bit 1.8 GHz 12× 25 W Socket S1G4 October 4, 2010 TMP540SGR23GM
Turion II P560 2.5 GHz 2 × 1 MB 128-bit 1.8 GHz 12.5× 25 W Socket S1G4 October 19, 2010 TMP560SGR23GM
Turion II N530 2.5 GHz 2 × 1 MB 128-bit 1.8 GHz 12.5× 35 W Socket S1G4 May 12, 2010 TMN530DCR23GM
Turion II N550 2.6 GHz 2 × 1 MB 128-bit 1.8 GHz 13× 35 W Socket S1G4 October 4, 2010 TMN550DCR23GM
Turion II N570 2.7 GHz 2 × 1 MB 128-bit 1.8 GHz 13.5× 35 W Socket S1G4 January 4, 2011 TMN570DCR23GM


Phenom II

[edit]
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Unlike desktop models, mobile Phenom II-based models do not have L3 cache
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

[edit]

Dual-core mobile processor

Model number Clock
speed
L2 cache FPU width[10] Hyper
Transport
Multi TDP Socket Release date Part number
Phenom II P650 2.6 GHz 2 × 1 MB 128-bit 1.8 GHz 13× 25 W Socket S1G4 October 19, 2010 HMP650SGR23GM
Phenom II N620 2.8 GHz 2 × 1 MB 128-bit 1.8 GHz 14× 35 W Socket S1G4 May 12, 2010 HMN620DCR23GM
Phenom II N640 2.9 GHz 2 × 1 MB 128-bit 1.8 GHz 14.5× 35 W Socket S1G4 October 4, 2010 HMN640DCR23GM
Phenom II N660 3.0 GHz 2 × 1 MB 128-bit 1.8 GHz 15× 35 W Socket S1G4 January 4, 2011 HMN660DCR23GM
Phenom II X620 BE 3.1 GHz 2 × 1 MB 128-bit 1.8 GHz 15.5× 45 W Socket S1G4 May 12, 2010 HMX620HIR23GM
Phenom II X640 BE 3.2 GHz 2 × 1 MB 128-bit 1.8 GHz 16× 45 W Socket S1G4 May 10, 2011 HMX640HIR23GM


Triple-core mobile processors

Model number Clock
speed
L2 cache FPU width[10] Hyper
Transport
Multi TDP Socket Release date Part number
Phenom II P820 1.8 GHz 3 × 512 KB 128-bit 1.8 GHz 25 W Socket S1G4 May 12, 2010 HMP820SGR32GM
Phenom II P840 1.9 GHz 3 × 512 KB 128-bit 1.8 GHz 9.5× 25 W Socket S1G4 October 4, 2010 HMP840SGR32GM
Phenom II P860 2.0 GHz 3 × 512 KB 128-bit 1.8 GHz 10× 25 W Socket S1G4 October 4, 2010 HMP860SGR32GM
Phenom II N830 2.1 GHz 3 × 512 KB 128-bit 1.8 GHz 10.5× 35 W Socket S1G4 May 12, 2010 HMN830DCR32GM
Phenom II N850 2.2 GHz 3 × 512 KB 128-bit 1.8 GHz 11× 35 W Socket S1G4 October 4, 2010 HMN850DCR32GM
Phenom II N870 2.3 GHz 3 × 512 KB 128-bit 1.8 GHz 11.5× 35 W Socket S1G4 January 4, 2011 HMN870DCR32GM


Quad-core mobile processors

Model number Clock
speed
L2 cache FPU width[10] Hyper
Transport
Multi TDP Socket Release date Part number
Phenom II P920 1.6 GHz 4 × 512 KB 128-bit 1.8 GHz 25 W Socket S1G4 May 12, 2010 HMP920SGR42GM
Phenom II P940 1.7 GHz 4 × 512 KB 128-bit 1.8 GHz 8.5× 25 W Socket S1G4 October 4, 2010 HMP940SGR42GM
Phenom II P960 1.8 GHz 4 × 512 KB 128-bit 1.8 GHz 25 W Socket S1G4 October 19, 2010 HMP960SGR42GM
Phenom II N930 2.0 GHz 4 × 512 KB 128-bit 1.8 GHz 10× 35 W Socket S1G4 May 12, 2010 HMN930DCR42GM
Phenom II N950 2.1 GHz 4 × 512 KB 128-bit 1.8 GHz 10.5× 35 W Socket S1G4 October 4, 2010 HMN950DCR42GM
Phenom II N970 2.2 GHz 4 × 512 KB 128-bit 1.8 GHz 11× 35 W Socket S1G4 January 4, 2011 HMN970DCR42GM
Phenom II X920 BE 2.3 GHz 4 × 512 KB 128-bit 1.8 GHz 11.5× 45 W Socket S1G4 May 12, 2010 HMX920HIR42GM
Phenom II X940 BE 2.4 GHz 4 × 512 KB 128-bit 1.8 GHz 12× 45 W Socket S1G4 January 4, 2011 HMX940HIR42GM


Brazos platform (2011)

[edit]

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit AMD APU codenamed Ontario, Zacate and with the following:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1066 or 1333 MHz (E-450) memory
    • 9 W or 18 W TDP
  • Radeon HD 6xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario" (40 nm)

[edit]
Model Number Step. CPU GPU Memory
Support
TDP Released Part Number Info
Cores Freq. Turbo L2 Cache Mult. Voltage Model Config Freq.
C-30 B0 1 1.2 GHz 512 kB 12× 1.25 – 1.35 HD 6250 80:8:4 276 MHz DDR3-1066 9 W January 4, 2011 CMC30AFPB12GT C-30
C-50 2 1.0 GHz 2 × 512 kB 10× 1.05 – 1.35 277 MHz CMC50AFPB22GT C-50
C-60 C0 1.33 GHz HD 6290 276 – 400 MHz August 22, 2011 CMC60AFPB22GV C-60

"Zacate" (40 nm)

[edit]
  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model Number Step. CPU GPU Memory
Support
TDP Released Part Number Info
Cores Freq. Turbo L2 Cache Mult. Voltage Model Config Freq.
E-240 B0 1 1.5 GHz 512 kB 15× 1.175 – 1.35 HD 6310 80:8:4 500 MHz DDR3-1066 18 W January 4, 2011 EME240GBB12GT E-240
E-300 B0 2 1.3 GHz 2 × 512 kB 13× 488 MHz August 22, 2011 EME300GBB22GV E-300
E-350 B0 1.6 GHz 16× 1.25 – 1.35 492 MHz January 4, 2011 EME350GBB22GT E-350
E-450 B0 1.65 GHz 16.5× HD 6320 508 – 600 MHz DDR3-1333 August 22, 2011 EME450GBB22GV E-450

Sabine (Fusion) platform (2011)

[edit]

The Sabine platform[15] introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Llano, and with the following:
    • made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 35 W or 45 W TDP
  • Radeon HD 6xxxG GPU on 32 nm process
    • Sumo graphics core with up to 400 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Llano" (32 nm)

[edit]
  • SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
  • Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.148 billion
  • Die size: 228 mm²
Model Number Step. CPU GPU Memory
Support
TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config1 Freq.
E2-3000M B0 2 1.8 GHz 2.4 GHz 2 × 512 kB 18x 0.9125 – 1.4125 HD 6380G 160:8:4 400 MHz DDR3-1333 35 W FS1 June 14, 2011 EM3000DDX22GX
A4-3300M B0 2 1.9 GHz 2.5 GHz 2 × 1 MB 19x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3300DDX23GX
A4-3305M B0 2 1.9 GHz 2.5 GHz 2 × 512 kB 19x 0.8750 – 1.4125 HD 6480G 160:8:4 593 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3305DDX22GX
A4-3310MX B0 2 2.1 GHz 2.5 GHz 2 × 1 MB 21x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3310HLX23GX
A4-3320M B0 2 2.0 GHz 2.6 GHz 2 × 1 MB 20x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3320DDX23GX
A4-3330MX B0 2 2.2 GHz 2.6 GHz 2 × 1 MB 22x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3330HLX23GX
A6-3400M B0 4 1.4 GHz 2.3 GHz 4 × 1 MB 14x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3400DDX43GX
A6-3410MX B0 4 1.6 GHz 2.3 GHz 4 × 1 MB 16x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3410HLX43GX
A6-3420M B0 4 1.5 GHz 2.4 GHz 4 × 1 MB 15x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3420DDX43GX
A6-3430MX B0 4 1.7 GHz 2.4 GHz 4 × 1 MB 17x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3430HLX43GX
A8-3500M B0 4 1.5 GHz 2.4 GHz 4 × 1 MB 15x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3500DDX43GX
A8-3510MX B0 4 1.8 GHz 2.5 GHz 4 × 1 MB 18x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3510HLX43GX
A8-3520M B0 4 1.6 GHz 2.5 GHz 4 × 1 MB 16x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3520DDX43GX
A8-3530MX B0 4 1.9 GHz 2.6 GHz 4 × 1 MB 19x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3530HLX43GX
A8-3550MX B0 4 2.0 GHz 2.7 GHz 4 × 1 MB 20x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3550HLX43GX

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

[edit]

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit AMD APU codenamed Zacate and with the following:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1333 MHz memory
    • 18 W TDP
  • Radeon HD 7xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario", "Zacate" (40 nm)

[edit]
  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Single-channel DDR3 SDRAM, DDR3L SDRAM
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model Number Step. CPU GPU Memory
Support
TDP Release Date Part Number
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config Freq. Turbo
C-70 C0 2 1.0 GHz 1.33 GHz 2 × 512 kB 10× HD 7290 80:8:4 276 MHz 400 MHz DDR3-1066 09 W September 27, 2012 CMC70AFPB22GV
E1-1200 B0 1.4 GHz 14× HD 7310 500 MHz 18 W June 6, 2012 EM1200GBB22GV
E2-1500 1.48 GHz 529 MHz January 7, 2013
E2-1800 1.7 GHz 17× HD 7340 523 MHz 680 MHz DDR3-1333 June 6, 2012 EM1800GBB22GV
E2-2000 1.75 GHz 538 MHz 700 MHz January 7, 2013

Comal (Fusion) platform (2012)

[edit]

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Trinity, and with the following:
    • Piledriver cores made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 17 W, 25 W or 35 W TDP
  • Radeon HD 7xxxG GPU on 32 nm process
    • Devastator graphics core with up to 384 SP
    • DirectX 11
    • UVD 3.2
Mobile chipset

"Trinity" (2012, 32 nm)

[edit]
Model Number Step. CPU GPU Memory
Support
TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config1 Freq. Turbo
standard power
A4-4300M B0 2 2.5 GHz 3.0 GHz 1 MB 25× 0.8125 – 1.3 HD 7420G 128:8:4 480 MHz 655 MHz DDR3-1600 35 W FS1r2 May 2012 AM4300DEC23HJ
A6-4400M B0 2 2.7 GHz 3.2 GHz 1 MB 27× 0.8125 – 1.3 HD 7520G 192:12:4 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4400DEC23HJ
A8-4500M B0 4 1.9 GHz 2.8 GHz 2 × 2 MB 19× 0.8125 – 1.3 HD 7640G 256:16:8 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4500DEC44HJ
A10-4600M B0 4 2.3 GHz 3.2 GHz 2 × 2 MB 23× 0.8125 – 1.3 HD 7660G 384:24:8 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4600DEC44HJ
low power
A4-4355M B0 2 1.9 GHz 2.4 GHz 1 MB 21× HD 7400G 192:12:4 327 MHz 424 MHz DDR3-1333 17 W FP2 September 27, 2012 AM4355SHE23HJ
A6-4455M B0 2 2.1 GHz 2.6 GHz 2 MB 21× 0.775 – 1.15 HD 7500G 256:16:8 327 MHz 424 MHz DDR3-1333 17 W FP2 May 15, 2012 AM4455SHE24HJ
A8-4555M B0 4 1.6 GHz 2.4 GHz 2 × 2 MB 16× HD 7600G 384:24:8 320 MHz 424 MHz DDR3-1333 19 W FP2 September 27, 2012 AM4555SHE44HJ
A10-4655M B0 4 2.0 GHz 2.8 GHz 2 × 2 MB 20× 0.85 – 1.2 HD 7620G 384:24:8 360 MHz 496 MHz DDR3-1333 25 W FP2 May 15, 2012 AM4655SIE44HJ

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)

[edit]
  • Elite Performance APU.[16][17]
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.303 billion
  • Die size: 246 mm²
Model Number Step. CPU GPU Memory
Support
TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config Freq. Turbo
standard power
A4-5150M 2 2.7 GHz 3.3 GHz 1 MB HD 8350G 128:8:4 533 MHz 720 MHz DDR3-1600 35 W FS1r2 Q1 2013 AM5150DEC23HL
A6-5350M 2.9 GHz 3.5 GHz HD 8450G 192:12:4 533 MHz 720 MHz DDR3-1600 FS1r2 Q1 2013 AM5350DEC23HL
A6-5357M 2.9 GHz 3.5 GHz HD 8450G 192 533 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5357DFE23HL
A8-5550M 4 2.1 GHz 3.1 GHz 2 × 2 MB HD 8550G 256:16:8 515 MHz 720 MHz DDR3-1600 FS1r2 Q1 2013 AM5550DEC44HL
A8-5557M 2.1 GHz 3.1 GHz HD 8550G 256 554 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5557DFE44HL
A10-5750M 2.5 GHz 3.5 GHz HD 8650G 384:24:8 533 MHz 720 MHz DDR3-1866 FS1r2 Q1 2013 AM5750DEC44HL
A10-5757M 2.5 GHz 3.5 GHz HD 8650G 384 600 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5757DFE44HL
low power
A4-5145M 2 2.0 GHz 2.6 GHz 1 MB HD 8310G 128 424 MHz 554 MHz DDR3L-1333 17 W FP2 (BGA) May 2013 AM5145SIE44HL?
A6-5345M 2.2 GHz 2.8 GHz HD 8410G 192 450 MHz 600 MHz DDR3L-1333 May 2013 AM5345SIE44HL?
A8-5545M 4 1.7 GHz 2.7 GHz 2 × 2 MB HD 8510G 384 450 MHz 554 MHz DDR3L-1333 19 W May 2013 AM5545SIE44HL
A10-5745M 2.1 GHz 2.9 GHz HD 8610G 384 533 MHz 626 MHz DDR3L-1333 25 W May 2013 AM5745SIE44HL

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

[edit]
AMD mobile Initial platform
Mobile processor Processors
  • Dual-core or quad-core 64-bit AMD APU codenamed Kabini, Temash and with the following:
    • Jaguar cores made on 28 nm CMOS process
    • support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory
    • 3.9 – 25 W TDP
  • Radeon HD 8xxx GPU on 28 nm process
  • Integrated FCH
  • SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, CLMUL, AES, F16C, ABM, BMI1, NX bit, AMD64, PowerNow!, AMD-V
  • Socket FT3 (BGA)
  • Turbo Dock Technology, C6 and CC6 low power states

"Temash" (2013, 28 nm)

[edit]

Elite Mobility APU:

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult.1 Vcore Model Config1 Freq. Turbo
A4-1200 B0[citation needed] 2 1.0 GHz 1 MB HD 8180 128:8:4 225 MHz DDR3L-1066 3.9 W May 2013 AT1200IFJ23HM
A4-1250 HD 8210 300 MHz DDR3L-1333 8 W May 2013 AT1250IDJ23HM
A6-1450 4 1.4 GHz 2 MB HD 8250 300 MHz 400 MHz DDR3L-1066 8 W May 2013 AT1450IDJ44HM

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)

[edit]

Mainstream APU:

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult.1 Vcore Model Config1 Freq. Turbo
E1-2100 B0 2 1.00 GHz 1 MB HD 8210 128:8:4 300 MHz DDR3L-1333 09 W May 2013 EM2100ICJ23HM
E1-2500 1.40 GHz HD 8240 400 MHz DDR3L-1333 15 W May 2013 EM2500IBJ23HM
E2-3000 1.65 GHz HD 8280 450 MHz DDR3L-1600 15 W May 2013 EM3000IBJ23HM
A4-5000 4 1.50 GHz 2 MB HD 8330 500 MHz DDR3L-1600 15 W May 2013 AM5000IBJ44HM
A6-5200 2.00 GHz HD 8400 600 MHz DDR3L-1600 25 W May 2013 AM5200IAJ44HM

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)

[edit]

Mullins, Tablet/2-in-1 APU

[edit]
Model Stepping CPU GPU Memory
support
TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1 Micro-6200T 2 1.0 GHz 1.4 GHz 1 MB 0.50 – 1.40 V R2 128:8:4 300 MHz DDR3L-1066 3.95 W Q2 2014 EM620TIWJ23JB
A4 Micro-6400T 4 1.0 GHz 1.6 GHz 2 MB R3 350 MHz DDR3L-1333 4.5 W Q2 2014 AM640TIVJ44JB
A10 Micro-6700T 1.2 GHz 2.2 GHz 2 MB R6 500 MHz DDR3L-1333 4.5 W Q2 2014 AM670TIVJ44JB

Beema, Notebook APU

[edit]
Model Stepping CPU GPU Memory
support
TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1-6010 2 1.35 GHz 1 MB 0.50 – 1.40 V R2 128:8:4 350 MHz DDR3L-1333 10 W Q2 2014 EM6010IUJ23JB
E2-6110 4 1.5 GHz 2 MB R2 500 MHz DDR3L-1600 15 W Q2 2014 EM6110ITJ44JB
A4-6210 1.8 GHz R3 600 MHz DDR3L-1600 15 W Q2 2014 AM6210ITJ44JB
A6-6310 1.8 GHz 2.4 GHz R4 800 MHz DDR3L-1866 15 W Q2 2014 AM6310ITJ44JB
A8-6410 2 GHz 2.4 GHz R5 800 MHz DDR3L-1866 15 W Q2 2014

AM6410ITJ44JB

Kaveri (2014)

[edit]
Model number CPU GPU Memory
support
TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
low power
A6-7000 2 2.2 GHz 3.0 GHz 1 MB 22× R4 192:12:4 494 MHz 533 MHz DDR3-1333 17W FP3 June 2014 AM7000ECH23JA
A6 Pro-7050B 553 MHz AM705BECH23JA
A8-7100 4 1.8 GHz 3.0 GHz 2× 2 MB 18× R5 256:16:4 450 MHz 514 MHz DDR3-1600 19W FP3 June 2014 AM7100ECH44JA
A8 Pro-7150B 1.9 GHz 3.2 GHz 19× 553 MHz AM715BECH44JA
A10-7300 1.9 GHz 3.2 GHz 19× R6 384:24:8 464 MHz 533 MHz AM7300ECH44JA
A10 Pro-7350B 2.1 GHz 3.3 GHz 21× 553 MHz AM735BECH44JA
FX-7500 2.1 GHz 3.3 GHz 21× R7 384:24:8 498 MHz 533 MHz FM7500ECH44JA
standard power
A8-7200P 4 2.4 GHz 3.3 GHz 2× 2 MB 24× R5 256:16:4 553 MHz 626 MHz DDR3-1866 35W FP3 June 2014 AM740PDGH44JA
A10-7400P 2.5 GHz 3.4 GHz 25× R6 384:24:8 576 MHz 654 MHz AM740PDGH44JA
FX-7600P 2.7 GHz 3.6 GHz 27× R7 512:32:8 600 MHz 686 MHz DDR3-2133 FM760PDGH44JA

Carrizo-L (2015)

[edit]
Model Stepping CPU GPU Memory
support
TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1-7010 2 1.5 GHz 1 MB 0.50 – 1.40 V R2 128:8:4 400 MHz DDR3L-1333 10 W May 2015 EM7010IUJ23JB
E2-7110 4 1.8 GHz 2 MB R2 600 MHz DDR3L-1600 12-25 W May 2015 EM7110ITJ44JB
A4-7210 1.8 GHz 2.2 GHz R3 686 MHz DDR3L-1600 12-25 W May 2015 AM7210ITJ44JB
A6-7310 2.0 GHz 2.4 GHz R4 800 MHz DDR3L-1866 12-25 W May 2015 AM7310ITJ44JB
A8-7410 2.2 GHz 2.5 GHz R5 847 MHz DDR3L-1866 12-25 W May 2015 AM7410ITJ44JB

Carrizo (2015)

[edit]
Model number CPU GPU Memory
support
TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
standard power and low power (configurable TDP)
A6-8500P 2 1.6 GHz 3.0 GHz 1 MB 16× R5 256:16:4 800 MHz DDR3-1600 12-35W FP4 June 2015 AM850PAAY23KA
A6 PRO-8500B 800 MHz AM850BAAY23KA
A8-8600P 4 1.6 GHz 3.0 GHz 2× 1 MB 16× R6 384:24:8 720 MHz DDR3-2133 12-35W FP4 June 2015 AM860PAAY43KA
A8 PRO-8600B 1.6 GHz 3.0 GHz 16× 720 MHz AM860BAAY43KA
A10-8700P 1.8 GHz 3.2 GHz 18× R6 384:24:8 800 MHz AM870PAAY43KA
A10 Pro-8700B 1.8 GHz 3.2 GHz 18× 800 MHz AM870BAAY43KA
FX-8800P 2.1 GHz 3.4 GHz 21× R7 512:32:8 800 MHz FM880PAAY43KA
A12 Pro-8800B 2.1 GHz 3.4 GHz 21× 800 MHz FM880BAAY43KA

Bristol Ridge (2016)

[edit]
Model number CPU GPU Memory
support
TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
standard power and low power (configurable TDP)
A10-9600P 4 2.4 GHz 3.3 GHz 2× 1 MB R5 384:24:8 720 MHz DDR4-1866 12–15W FP4 June 2016 AM960PADY44AB
A10-9600B PRO October 2016 AM960BADY44AB
A10-9630P 2.6 GHz 3.3 GHz 800 MHz DDR4-2400 25–45W June 2016 AM963PAEY44AB
A10-9630B PRO October 2016 AM963BAEY44AB
A12-9700P 2.5 GHz 3.4 GHz R7 384:24:8 758 MHz DDR4-1866 12–15W June 2016 AM970PADY44AB
A12-9700B PRO DDR4-1866 October 2016 AM970BADY44AB
A12-9730P 2.8 GHz 3.5 GHz 900 MHz DDR4-2400 25–45W June 2016 AM973PAEY44AB
A12-9730B PRO October 2016 AM973BAEY44AB
FX-9800P 2.7 GHz 3.6 GHz 512:32:8 758 MHz DDR4-1866 12–15W June 2016 FM980PADY44AB
A12-9800B PRO October 2016 AM980BADY44AB
FX-9830P 3.0 GHz 3.7 GHz 900 MHz DDR4-2400 25–45W June 2016 FM983PAEY44AB
A12-9830B PRO October 2016 AM983BAEY44AB

"Raven Ridge" (2017)

[edit]
Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(MHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Athlon Pro 200U 2019 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Radeon Vega 3 192:12:4
3 CU
1000 384 FP5 12 (8+4) DDR4-2400
dual-channel
12–25 W
Athlon 300U Jan 6, 2019 2.4 3.3
Ryzen 3 2200U Jan 8, 2018 2.5 3.4 1100 422.4
Ryzen 3 3200U Jan 6, 2019 2.6 3.5 1200 460.8
Ryzen 3 2300U Jan 8, 2018 4 (4) 2.0 3.4 Radeon Vega 6 384:24:8
6 CU
1100 844.8
Ryzen 3 Pro 2300U May 15, 2018
Ryzen 5 2500U Oct 26, 2017 4 (8) 3.6 Radeon Vega 8 512:32:16
8 CU
1126.4
Ryzen 5 Pro 2500U May 15, 2018
Ryzen 5 2600H Sep 10, 2018 3.2 DDR4-3200
dual-channel
35–54 W
Ryzen 7 2700U Oct 26, 2017 2.2 3.8 Radeon RX Vega 10 640:40:16
10 CU
1300 1664 DDR4-2400
dual-channel
12–25 W
Ryzen 7 Pro 2700U May 15, 2018 Radeon Vega 10
Ryzen 7 2800H Sep 10, 2018 3.3 Radeon RX Vega 11 704:44:16
11 CU
1830.4 DDR4-3200
dual-channel
35–54 W
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)

[edit]

Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 3780U[18] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU
1971.2 15 W Oct 2019
3750H[19] RX Vega 10 640:40:16
10 CU[20]
1792.0 35 W Jan 6, 2019
3700C[21] 15 W Sep 22, 2020
3700U[a][22] Jan 6, 2019
Ryzen 5 3580U[23] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU
1497.6 Oct 2019
3550H[24] Vega 8 1.2 512:32:16
8 CU[25]
1228.8 35 W Jan 6, 2019
3500C[26] 15 W Sep 22, 2020
3500U[a][27] Jan 6, 2019
3450U[28] 3.5 Jun 2020
Ryzen 3 3350U[29] 4 (4) Vega 6 384:24:8
6 CU[30]
921.6 Jan 6, 2019
3300U[a][31]
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[32][33][34], released April 8, 2019.

"Renoir" (2020)

[edit]

U

[edit]
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(MHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 4980U 8 (16) 2.0 4.4 8 MB 2 × 4 Radeon
Graphics[a]
1950 512:32:8
8 CU
1996.8 15 W Apr 13, 2021
4800U 1.8 4.2 1750 1792 Mar 16, 2020
Pro 4750U 1.7 4.1 1600 448:28:8
7 CU
1433.6 May 7, 2020
4700U 8 (8) 2.0 Mar 16, 2020
Ryzen 5 4680U 6 (12) 2.1 4.0 2 × 3 1500 1344 Apr 13, 2021
Pro 4650U 384:24:8
6 CU
1152 May 7, 2020
4600U Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 Pro 4450U 4 (8) 2.5 3.7 4 MB 1 × 4 1400 320:20:8
5 CU
896 May 7, 2020
4300U 4 (4) 2.7 Mar 16, 2020
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

H

[edit]
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(MHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics[a]
1750 512:32:8
8 CU
1792 45 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H 2.9 4.2 1600 448:28:8
7 CU
1433.6 45 W
4800HS
Ryzen 5 4600H 6 (12) 3.0 4.0 2 × 3 1500 384:24:8
6 CU
1152
4600HS[35][36][37] 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)

[edit]

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a]
1.9 512:32:8
8 CU
1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[38] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU
1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU
1152
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)

[edit]

U

[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5800U[note 1][39] 8 (16) 1.9 4.4 16 MB 1 × 8 Radeon
Graphics[a]
2.0 512:32:8
8 CUs
2048 10–25 W Jan 12, 2021
Ryzen 5 5600U[note 1][40] 6 (12) 2.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8
5560U[41] 4.0 8 MB 1.6 384:24:8
6 CUs
1228.8
Ryzen 3 5400U[note 1][42][43] 4 (8) 2.7 4.1 1 × 4
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d Model also available as Pro version as 5450U,[44] 5650U,[45] 5850U,[46] released on March 16, 2021.

H

[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 5980HX[47] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics[a]
2.1 512:32:8
8 CUs
2150.4 35–54 W Jan 12, 2021
5980HS[48] 3.0 35 W
5900HX[49] 3.3 4.6 35–54 W
5900HS[50] 3.0 35 W
Ryzen 7 5800H[51][52] 3.2 4.4 2.0 2048 35–54 W
5800HS[53] 2.8 35 W
Ryzen 5 5600H[54][55] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs
1612.8 35–54 W
5600HS[56] 3.0 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)

[edit]
Branding and model CPU GPU TDP Release
date
Cores
(Threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5825U[note 1][note 2][57] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics[a]
2.0 512:32:8
8 CUs
2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][58] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs
1612.8
Ryzen 3 5125C[59] 2 (4) 3.0 8 MB 1 × 2 ? 192:12:8
3 CU
? May 5, 2022
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as Pro version as 5475U,[60] 5675U,[61] 5875U,[62] released on April 19, 2022.
  2. ^ a b c Model also available as Chromebook optimized version as 5425C,[63] 5625C,[64] 5825C,[65] released on May 5, 2022.

"Rembrandt" (2022)

[edit]

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs
3686.4 45 W Jan 4, 2022
[66]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs
1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[67], 6650H[68], 6650HS[69], 6850U[70], 6850H[71], 6850HS[72], 6950H[73], 6950HS[74]), released on April 19, 2022.

Mendocino (7020 series, Zen2/RDNA2 based)

[edit]

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 1
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Processing
power[ii]
(GFLOPS)
Base Boost
Ryzen 5 7520U[iii] 4 (8) 2.8 4.3 4 MB 1 × 4 610M
2 CU
1.9 486.4 15 W September 20, 2022[75]
Ryzen 3 7320U[iii] 2.4 4.1
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. ^ a b Model also available as Chromebook optimized version as 7520C[76] and 7320C[77] released on May 23, 2023


Barcelo-R (7030 series, Zen3/GCN5 based)

[edit]

Common features of Ryzen 7030 notebook APUs:

  • Socket: FP6.
  • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC N7 FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU
2.0 2048 15 W January 4, 2023
[78]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU
1792
Ryzen 3 (PRO) 7330U 4 (8) 2.3 4.3 8 MB 1 × 4 Vega
6 CU
1.8 1382.4
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

[edit]

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date[79]
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU
2.2 3379.2 35–54 W April 30, 2023
7735H
7736U 2.7 4.7 15–28 W January 4, 2023
7735U 4.75 15–30 W
7435HS 3.1 4.5 35–54 W 2024[80]
7435H
Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
6 CU
1.9 1459.2 April 30, 2023
7535H
7535U 2.9 15–30 W January 4, 2023
7235HS 4 (8) 3.2 4.2 8 MB 1 × 4 35–53 W 2024[81]
7235H
Ryzen 3 7335U 3.0 4.3 660M
4 CU
1.8 921.6 15–30 W January 4, 2023
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen4/RDNA3 based)

[edit]

Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC N4 FinFET.
Branding and model CPU GPU NPU PCIe
(lanes)
TDP Release
date[82]
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[a]
Model Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen 9 (PRO) 7940HS 8 (16) 8 (16) 4.0 5.2 16 MB 1 × 8 780M
12 CU
2.8 Ryzen AI
Up to 10 TOPS
20 35–54 W April 30, 2023[b]
7940H[c]
Ryzen 7 (PRO) 7840HS 3.8 5.1 2.7
7840H[c]
(PRO) 7840U 3.3 15–30 W May 3, 2023[b]
Ryzen 5 (PRO) 7640HS 6 (12) 6 (12) 4.3 5.0 1 × 6 760M
8 CU
2.6 35–54 W April 30, 2023[b]
7640H[c]
(PRO) 7640U 3.5 4.9 15–30 W May 3, 2023[b]
(PRO) 7545U 2 (4) 4 (8) 3.7 / 3.0[d] 4.9 / 3.5[e] 2 + 4 740M
4 CU
2.8 No 14 November 2, 2023
(PRO) 7540U 6 (12) 3.2 4.9 1 × 6 2.5 May 3, 2023[b]
Ryzen 3 7440U 4 (8) 1 (2) 3 (6) 3.6 / 2.8[d] 4.7 / 3.3[e] 8 MB 1 + 3
  1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. ^ a b c d e PRO versions launched on 13 June 2023.
  3. ^ a b c China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
  4. ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
  5. ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen4/RDNA2 based)

[edit]

Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
Branding and model Cores
(threads)
Clock (GHz) L3 cache
(total)
Chiplets Core
config[a]
TDP Release
date[83]
Base Boost
Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB[ii] 2 × CCD
1 × I/OD
2 × 8 55–75 W July 27, 2023
7945HX 2.5 64 MB February 28, 2023
7940HX 2.4 5.2 January 17, 2024
7845HX 12 (24) 3.0 5.2 2 × 6 45–75 W February 28, 2023
Ryzen 7 7840HX 2.9 5.1 January 17, 2024
7745HX 8 (16) 3.6 5.1 32 MB 1 × CCD
1 × I/OD
1 × 8 February 28, 2023
Ryzen 5 7645HX 6 (12) 4.0 5.0 1 × 6
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

See also

[edit]

References

[edit]
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[edit]