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Template:AMD Ryzen Mobile 7045 series

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Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
Branding and model Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Chiplets Core
config[a] 		TDP Release
date
Base Boost
Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB[ii] 2 × CCD
1 × I/OD 		2 × 8 55–75 W July 27, 2023
7945HX 2.5 64 MB February 28, 2023
7940HX 2.4 5.2 January 17, 2024
7845HX 12 (24) 3.0 5.2 2 × 6 45–75 W February 28, 2023
[1]
Ryzen 7 7745HX 8 (16) 3.6 5.1 32 MB 1 × CCD
1 × I/OD 		1 × 8
Ryzen 5 7645HX 6 (12) 4.0 5.0 1 × 6
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.
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